当前申请(专利权)人地址：
Level 3 - Building 3, One Central Dubai World Trade Centre,PO Box 9573,Dubai AE
摘要：
There is disclosed a method of manufacturing a light emitting diode (LED) arrangement, the method comprising the steps of installing an LED (101) on a circuit board (103); and covering the circuit board (103) and other electronic components on the circuit board (103) with a layer of silicone coating (107); wherein a top emitting area (109) of the LED (101) is kept exposed or uncovered for increasing efficiency of the LED arrangement. Also disclosed is a lighting system, comprising a plurality of light emitting diode (LED) strips (111) in connection with a photo-voltaic (PV) panel (115), the LED strips (111) comprising a plurality of LEDs (101) and infra-red (IR) LEDs (113), wherein the plurality of LEDs (101) and IR LEDs (113) are installed on the LED strips (111) at a ratio of 1:8, for mitigating shadow losses and for increasing efficiency of the lighting arrangement.
权利要求：
CLAIMS
1. A method of manufacturing a light emitting diode (LED) arrangement, the method comprising the steps of: installing an LED on a circuit board; and covering the circuit board and other electronic components on the circuit board with a layer of silicon coating; wherein a top emitting area of the LED is kept exposed or uncovered for increasing efficiency of the LED arrangement.
2. The method of claim 1, wherein the LED is a phosphor-silicon chip.
3. The method of claim 1, wherein the other electronic components comprise copper and soldered areas of the circuit board.
4. The method of claim 1, wherein the LED arrangement is used as a grow light in an indoor farming environment.
5. The method of claim 1, wherein the layer of silicon coating protects the circuit board and electronic components on the circuit board from dust and moisture.
6. The method of claim 1, wherein the layer of silicon coating is 0.7 mm in thickness.
7. The method of claim 1, wherein the LED has dimensions of
3mmx3mmx0.7mm.
8. The method of claim 1, wherein the layer of silicon coating is 3D printed over the circuit board and other electronic components on the circuit board.
9. A lighting system, comprising: a plurality of light emitting diode (LED) strips in connection with a photovoltaic (PV) panel, the LED strips comprising a plurality of LEDs and infra-red (IR) LEDs, wherein the plurality of LEDs and IR LEDs are installed on the LED strips at a ratio of 1:6 to 1:10, for mitigating shadow losses and for increasing efficiency of the lighting arrangement.
10. The lighting system of claim 9, wherein the plurality of LEDs and IR LEDs are installed on the LED strips at a ratio of 1:8.
11. The lighting system of claim 9, wherein the plurality of LED strips are covered with a layer of silicon coating for protecting the plurality of LED strips from impurities and a top emitting area of the plurality of LEDs and IR LEDs is kept uncovered by the layer of silicon coating for increasing efficiency of the plurality of LEDs and IR LEDs.
12. The lighting system of claim 9, wherein the lighting system is used as grow lights for an indoor farming environment.
13. The lighting system of claim 9, wherein the plurality of LED strips are connected to each other in a series connection.
14. The lighting system of claim 9, wherein an input voltage to the plurality of LED strips is generated by the PV panel.
15. The lighting system of claim 9, further comprising robotic brushes adapted for cleaning of the PV panel.