国民经济行业分类号：
C4350 | C3874 | C4090 | C3879
当前申请(专利权)人：
MAGNA INTERNATIONAL INC. | CARBALLO, DANIEL | DURFEE, JASON, A. | HLAVACH, MARK | STIVERSON, JOEL
原始申请(专利权)人：
MAGNA INTERNATIONAL INC. | CARBALLO, DANIEL | DURFEE, JASON, A. | HLAVACH, MARK | STIVERSON, JOEL
当前申请(专利权)人地址：
337 Magna Drive,Aurora, Ontario L4G 7K1 CA | 2756 Stonebury Drive,Rochester Hills, MI 48307 US | 2345 Cloister Court,Troy, MI 48085 US | 1557 Swarthout Road,Pinckney, MI 48169 US | 28425 Florence Street,Saint Clair Shores, MI 48081 US
发明人：
CARBALLO, DANIEL | DURFEE, JASON, A. | HLAVACH, MARK | STIVERSON, JOEL
代理人：
PURRINGTON, JAMES, P., JR. ET AL.
摘要：
An electronic assembly includes a heat sink and a printed circuit board (PCB). The heat sink includes a shell of liquid tight material defining an open face and a porous wick containing a cooling fluid. The PCB includes a heat source and covering the open face of the first heat sink and contacting the porous wick. The heat sink is configured to cause the cooling fluid to migrate through the porous wick between the shell and the PCB and to change from a liquid to a gas phase to convey the heat from the heat source to the shell. The heat sink may include a lug and/or a rim adjacent to the PCB. One or more fasteners, pins, or studs may be used to secure the PCB to the lug and/or the rim of the heat sink. A peripheral wall may provide a seal with an edge of the PCB.
权利要求：
CLAIMS
What is claimed is:
1. An electronic assembly comprising: a heat sink including a shell of liquid tight material defining an open face and a porous wick containing a cooling fluid; a printed circuit board (PCB) including a heat source and covering the open face of the heat sink and contacting the porous wick; and wherein the heat sink is configured to cause the cooling fluid to migrate through the porous wick between the shell and the PCB and to change from a liquid to a gas to convey the heat from the heat source to the shell.
2. The electronic assembly of claim 1, wherein the shell of the heat sink defines a plurality of fins spaced apart from the open face.
3. The electronic assembly of claim 1, wherein the porous wick comprises material melted or partially melted by additive manufacturing.
4. The electronic assembly of claim 3, wherein the shell comprises the same material as the porous wick and formed by additive manufacturing to have a porosity lesser than a porosity of the porous wick.
5. The electronic assembly of claim 1 , further comprising a fastener extending through or around the PCB and configured to secure the PCB onto the heat sink.
6. The electronic assembly of claim 5, further comprising a fastener seal disposed between the heat sink and the PCB and adjacent to the fastener, forming a liquid-tight seal therebetween.
7. The electronic assembly of claim 5, wherein the fastener comprises a screw or a bolt extending through the PCB and into a corresponding lug in the heat sink.
8. The electronic assembly of claim 5, wherein the fastener comprises a pin or a stud extending outwardly from the heat sink perpendicular to and beyond the open face thereof and extending through the PCB.
9. The electronic assembly of claim 8, wherein pin or stud includes a pin configured to be fastened to the PCB by a solder joint.
10. The electronic assembly of claim 1, further comprising the heat sink including a rim extending around at least a portion of a periphery of the open face, the rim extending parallel to the PCB.
11. The electronic assembly of claim 10, further comprising a peripheral gasket disposed between the rim and the PCB, forming a liquid-tight seal therebetween.
12. The electronic assembly of claim 10, wherein the heat sink further comprises a peripheral wall extending from the rim perpendicularly to the open face and around an edge of the
PCB .
13. The electronic assembly of claim 10, wherein the peripheral wall and the rim together define a channel for receiving a peripheral gasket forming a liquid tight seal between the heat sink and the edge of the PCB.
14. The electronic assembly of claim 13, wherein the edge of the PCB is pressed and formed into the channel to form the liquid tight seal between the heat sink and the edge of the PCB.
15. The electronic assembly of claim 13, further comprising a peripheral seal disposed over the PCB and adjacent to or within the channel.