权利要求：
CLAIMS:
1. A light source cooling body (100), substantially the whole light source cooling body (100) being manufactured of the same thermally conductive material, the light source cooling body (100) comprising:
a hollow space (210, 310, 410, 710) comprising an evaporator (116, 216, 316, 416, 716) and a condenser (112, 212, 312, 412, 712), the hollow space (210, 310, 410, 710) being configured to hold a cooling material partially in a gaseous phase and partially in a liquid phase, a wall of the hollow space (210, 310, 410, 710) being formed by the thermally conductive material, at least a portion (114) of the hollow space (210, 310, 410, 710) is tubular shaped, the hollow space (210, 310, 410, 710) further comprising a wick (211, 311, 411, 711) for transporting the cooling material in the liquid phase towards the evaporator
(116, 216, 316, 416, 716) for being evaporated when the evaporator (116, 216, 316, 416, 716) receives heat, the wick (211, 311, 411, 711) being manufactured of the thermally conductive material,
an interface area (102, 202) being arranged to thermally couple with a light source (250, 450, 750) and arranged to receive heat from the light source (250, 450, 750), the interface area (102, 202) being an outer area of the light source cooling body (100) arranged in a direct vicinity of the evaporator (116, 216, 316, 416, 716) and being separated by a thermally conductive wall from the evaporator (116, 216, 316, 416, 716) for allowing heat of the light source (250, 450, 750) to be transported towards the evaporator (116, 216, 316, 416, 716),
wherein
the condenser (112, 212, 312, 412, 712) being arranged away from the interface area (102, 202),
except the hollow space (210, 310, 410, 710), the light source cooling body (100) being a homogeneous body (104, 304, 404, 704) of the thermally conductive material, and
the interface area (102, 202) comprises a protrusion (202', 702') having a flat surface facing away from the light source cooling body (100), wherein the flat surface is configured to thermally couple with a surface of the light source (250, 450, 750).
2. A light source cooling body (100) according to claim 1 further comprising cooling fins (370, 470) for providing a cooling interface area to ambient air, the condenser (112, 212, 312, 412, 712) being arranged near the cooling fins (370, 470) for providing a thermal path from the condenser (112, 212, 312, 412, 712) to the cooling fins (370, 470), wherein the cooling fins (370, 470) are part of the homogeneous body (104, 304, 404, 704) of the thermally conductive material.
3. A light source cooling body (100) according to any one of the preceding claims, wherein a shape of the light source cooling body (100), and when referring to claim 2, optionally also a shape of the cooling fins (370, 470), is selected to allow a transmission of light generated by the light source (250, 450, 750) towards an ambient of the light source cooling body (100), wherein the light source (250, 450, 750) is provided on the interface area (102, 202).
4. A light source cooling body (100) according to any one of the preceding claims, wherein a thickness (th) of a thermally conductive wall between the interface area (102, 202) and the evaporator (116, 216, 316, 416, 716) is thinner than 2 millimeter. 5. A light source cooling body (100) according to any one of the preceding claims comprising a heat sink interface area arranged to thermally couple with a heat sink and configured to provide heat to the heat sink, the heat sink interface area being a further outside area of the light source cooling body (100) arranged close to the condenser (112, 212, 312, 412, 712) and optionally comprising connector elements for connecting a heat sink to the heat sink interface area.
6. A light source cooling body (100) according to any one of the preceding claims, wherein the wall of the hollow space (210, 310, 410, 710) is at least partially covered with the wick (211, 311, 411, 711) for transporting the cooling material in the liquid phase from the condenser (112, 212, 312, 412, 712) towards the evaporator (116, 216, 316, 416, 716).
7. A light source cooling body (100) according to any one of the preceding claims, wherein the hollow space (210, 310, 410, 710) forms a loop in which a vapor channel (318) is provided from the evaporator (116, 216, 316, 416, 716) towards the condenser (112, 212, 312, 412, 712) and a liquid channel (319) is provided from the condenser (112, 212, 312, 412, 712) to the evaporator (116, 216, 316, 416, 716), the wick (211, 311, 411, 711) being arranged to receive cooling material in the liquid phase from the liquid channel (319) or a liquid reservoir (372, 772) being fed by the liquid channel (319), the wick (211, 311, 411, 711) at least extending into the evaporator (116, 216, 316, 416, 716).
8. A light source cooling body (100) according to any one of the preceding claims, wherein at least one of:
- the thermally conductive material comprising at least one of Aluminum,
Copper, Magnesium, Iron, Nickel, CrNi steel, Carbon steel, a Copper-Zinc alloy, a Copper- Tin alloy, a thermally conducive plastic material, and a thermally conductive ceramic material such as Aluminum Nitride, Aluminum Oxide, Beryllium Oxide, Boron Nitride, Silicon Carbide, Titanium Oxide, Magnesium Oxide, Zinc Oxide , Silicon Nitride, Zirconium Oxide , Tungsten Carbide,
the cooling material comprising at least one of Water, Acetone, Ammonia, Methanole and Ethanole.
9. A light source assembly (200, 300, 400, 700) comprising:
- the light source cooling body (100) according to any one of the claims 1 to 8, a light source (250, 450, 750) provided on and being thermally coupled to the interface area (102, 202).
10. A light source assembly (200, 300, 400, 700) according to claim 9 further comprising electric conductors (360, 760) being provided on and isolated from the light source cooling body (100) for providing electrical power to the light source (250, 450, 750).
11. A light source assembly (200, 300, 400, 700) according to claim 9 or claim 10, wherein, when the light source cooling body (100) is a light source cooling body according to claim 2, a portion of the cooling fins (370, 470) are also arranged as an optical element for influencing, in use, a light beam emitted by the light source assembly (200, 300, 400, 700).
12. A light source assembly (200, 300, 400, 700) according to any one of the claims 9 to 11, wherein the light source is a flip chip Light Emitting Diode being provided on the protrusion, a light exit window of the flip chip Light Emitting Diode faces away from the flat surface of the protrusions, the flip chip Light Emitting Diode has an opposite surface opposite the light exit window, a portion of an opposite surface is provided on the flat surface and another portion of the opposite surface extends beyond the protrusion and comprises electrical contact areas.
13. A luminaire (550) comprising the light source cooling body (100) according to any one of the claims 1 to 8 or comprising a light source assembly (200, 300, 400, 700) according to any one of the claims 9 to 12.
14. Method (602) of manufacturing a light source cooling body, the method comprising:
receiving (610) a three dimensional model of a light source cooling body that comprises i) a hollow space comprising an evaporator and an condenser, the hollow space being configured to hold a cooling material partially in a gaseous phase and partially in a liquid phase, a wall of the hollow space being formed by the thermally conductive material, at least a portion of the hollow space is tubular shaped, the hollow space further comprising a wick for transporting the cooling material in the liquid phase towards the evaporator for being evaporated when the evaporator receives heat; ii) an interface area being arranged to thermally couple a light source to and configured to receive heat from the light source, wherein a) the interface area being arranged in a direct vicinity of the evaporator and being separated by a thermally conductive wall from the evaporator for allowing heat of the light source to be transported towards the evaporator, b) the condenser being arranged away from the interface area where the light source cooling body has an interface to an environment of the light source cooling body, c) except the interface area, the light source cooling body being a homogeneous body of the thermally conductive material, and, d) the interface area optionally comprises a protrusion having a flat surface facing away from the light source cooling body, the flat surface being configured to thermally couple with a surface of the light source,
- building (612) up the light source cooling body of a thermally conductive material by depositing layers on top of each other by means of an additive manufacturing technology according to the received three dimensional model of the light source cooling body.
15. A method (600) of manufacturing a light source assembly, the method comprising the method (602) of manufacturing a light source cooling body according to claim 14 and further comprising:
manufacturing (620) dielectric tracks of dielectric material on the light source cooling body, the dielectric tracks extending toward the interface area of the light source cooling body,
manufacturing (622) power tracks of an electrically conductive material on the dielectric tracks and providing connection areas at the interface area, the connection areas are for electrically coupling the light source to,
thermally coupling (630) a light source to the interface area and electrically connecting the light source to the connection areas.