当前申请(专利权)人：
UNITED TECHNOLOGIES CORPORATION
原始申请(专利权)人：
UNITED TECHNOLOGIES CORPORATION
当前申请(专利权)人地址：
One Financial Plaza,Hartford, CT 06101 US
发明人：
KLING, COLIN J. | PARKOS, JOSEPH | LOMASNEY, GARY M. | BOGUE, WILLIAM
摘要：
A method for balancing a rotatable component is disclosed This method comprises and then plating the component to deposit a metal layer onto the component until the component is balanced. In addition, and alternative method for balancing a rotatable component is disclosed. This method comprises attaching a balancing weight to the rotatable component and rotating the component. This is followed by plating the component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced.
权利要求：
WHAT IS CLAIMED IS:
1. A method for balancing a rotatable component, the method comprising:
rotating the component; and
plating the component to deposit a metal layer onto the component until the component is balanced.
2. The method of claim 1 wherein the plating is selected from the group consisting of brush plating and brush electroplating.
3. The method of claim 2 wherein the brush plating comprises a brush saturated with plating solution.
4. The method of claim 3 wherein the brush is selected from the group consisting of stainless steel or graphite.
5. The method of claim 4 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated.
6. The method of claim 2 wherein the brush electroplating comprises a brush saturated with plating solution.
7. The method of claim 6 wherein the brush is selected from the group consisting of stainless steel or graphite.
8. The method of claim 7 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated.
9. A method for balancing a rotatable component, the method comprising:
attaching a balancing weight to the rotatable component;
rotating the component; and plating the component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced.
10. The method of claim 9 wherein the plating is selected from the group consisting of brush plating and brush electroplating.
11. The method of claim 10 wherein the brush plating comprises a brush saturated with plating solution.
12. The method of claiml 1 wherein the brush is selected from the group consisting of stainless steel or graphite.
13. The method of claim 12 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated.
14. The method of claim 10 wherein the brush electroplating comprises a brush saturated with plating solution.
15. The method of claim 11 wherein the brush is selected from the group consisting of stainless steel or graphite.
16. The method of claim 12 wherein the brush is further wrapped with a cloth material that holds the plating solution and prevents direct contact with the part being plated.
17. The method of claim 9 wherein the balancing weight is selected from the group consisting of metals, metal powder filled resins and polymers.
18. A method for balancing a rotatable fan assembly, the method comprising:
attaching a balancing weight to the fan assembly;
rotating the fan assembly; and
plating the fan assembly and the balancing weight to deposit a metal layer onto the balancing weight and fan assembly until the fan assembly is balanced.
19. The method of claim 18 wherein the balancing weight is selected from the group consisting of metals, metal powder filled resins and polymers.
20. The method of claim 18 wherein the plating is selected from the group consisting of brush plating and brush electroplating.