权利要求：
1. A light source module, comprising:
a first substrate including,
a plurality of connectors configured to at least receive a supply of electrical power, and
a plurality of first connection pads configured to be electrically connected to the plurality of connectors;
a plurality of second substrates on the first substrate, each second substrate including,
a plurality of light-emitting devices on an upper surface of the second substrate, and
a plurality of second connection pads on a lower surface of the second substrate, the plurality of second connection pads configured to be electrically connected to the plurality of light-emitting devices; and
a plurality of connection members configured to electrically connect the plurality of first connection pads of the first substrate with the plurality of second connection pads of the plurality of second substrates.
2. The light source module of claim 1, wherein,
the first substrate is a single layer printed circuit board (PCB),
the plurality of connectors and the plurality of first connection pads are on a common surface of the first substrate, and
the second substrate is a double layer PCB.
3. The light source module of claim 1, wherein the plurality of connection members include solder balls or solder bumps.
4. The light source module of claim 3 further comprising:
an insulating material between the first substrate and at least one second substrate of the plurality of the second substrates, the insulating material further between the plurality of connection members.
5. The light source module of claim 1, wherein the second substrate is surface mounted on the first substrate.
6. The light source module of claim 1, wherein the plurality of light-emitting devices are mounted on the upper surface of the second substrate according to flip-chip bonding.
7. The light source module of claim 1, wherein each light-emitting device is a chip or a package.
8. The light source module of claim 1, wherein,
the plurality of light-emitting devices extends along a longitudinal axis of the second substrate, and
the plurality of second substrates extends along a longitudinal axis of the first substrate.
9. The light source module of claim 8, wherein the plurality of connectors are located in at least one end region of the first substrate.
10. (canceled)
11. A light source module, comprising:
a first substrate including,
a plurality of connectors configured to at least receive a supply of electrical power, and
a plurality of first connection pads configured to be electrically connected to the plurality of connectors;
a plurality of second substrates on the first substrate, each second substrate including,
a plurality of package substrates on an upper surface of the second substrate,
a plurality of light-emitting devices on the plurality of package substrates, each light-emitting device on a separate package substrate of the plurality of package substrates, and
a plurality of second connection pads on a lower surface of the second substrate, the plurality of second connection pads configured to be electrically connected to the plurality of light-emitting devices;
a plurality of connection members configured to electrically connect the plurality of first connection pads of the first substrate with the plurality of second connection pads of the plurality of second substrates.
12. The light source module of claim 11, wherein the package substrate includes a wavelength conversion material that covers each light-emitting device of the plurality of light emitting devices.
13. The light source module of claim 12, wherein the wavelength conversion material includes a fluorescent material or a quantum dot.
14. The light source module of claim 11, wherein,
the first substrate is a single layer PCB,
the plurality of connectors and the plurality of first connection pads are on a common surface of the first substrate, and
the second substrate is a double layer PCB.
15. The light source module of claim 11, wherein the second substrate is surface mounted on the first substrate.
16.-25. (canceled)
26. A light source module, comprising:
a first substrate including,
a plurality of connectors configured to at least receive a supply of electrical power, and
a plurality of first connection pads configured to be electrically connected to the plurality of connectors;
a plurality of second substrates on the first substrate, each second substrate including,
a plurality of mounting elements on an upper surface of the second substrate, each mounting element configured to electrically connect with a separate light-emitting device, and
a plurality of second connection pads on a lower surface of the second substrate, each second connection pad configured to be electrically connected to a separate mounting element of the plurality of mounting elements; and
a plurality of connection members configured to electrically connect the plurality of first connection pads of the first substrate with the plurality of second connection pads of the plurality of second substrates.
27. The light source module of claim 26, wherein,
the first substrate is a single layer printed circuit board (PCB),
the plurality of connectors and the plurality of first connection pads are on a common surface of the first substrate, and
the second substrate is a double layer PCB.
28. The light source module of claim 26 further comprising:
an insulating material between the first substrate and at least one second substrate of the plurality of the second substrates, the insulating material further between at least a portion of connection members of the plurality of connection members.
29. The light source module of claim 26, wherein,
each second substrate is configured to electrically connect to a separate plurality of light-emitting devices such that the separate plurality of light-emitting devices extends along a longitudinal axis of the second substrate, and
the plurality of second substrates extends along a longitudinal axis of the first substrate.
30. The light source module of claim 29, wherein,
the plurality of second substrates is an array of second substrates that extends in both a first direction and a second direction on the first substrate, and the second direction is perpendicular to the first direction.
31. The light source module of claim 26, wherein the plurality of connectors are located in at least one end region of the first substrate.
具体实施方式：
[0032]Hereinafter, the inventive concepts will be described in detail by explaining exemplary embodiments with reference to the attached drawings.
[0033]FIG. 1 is a perspective view that illustrates a first substrate 100 of a light source module according to some example embodiments.
[0034]Referring to FIG. 1, the first substrate 100 may have a bar shape that extends to a particular (or, alternatively, predetermined) length L1 in a longitudinal direction (a first direction).
[0035]As used herein, the terms ‘top’, ‘upper part’, ‘upper surface’, ‘bottom’, ‘lower part’, ‘lower surface’, or ‘side surface’ are used to describe positions in the drawing to which reference is made, but the positions may be changed depending on directions of a light-emitting device, a light source module, a backlight assembly, and/or a lighting device that are arranged.
[0036]The first substrate 100 may include a plurality of first mounting elements 120 positioned on a substrate upper surface 110; a plurality of first connection pads 130 positioned in the first mounting elements 120; and a plurality of connectors 140 located in an area around at least one of both ends (e.g., at least one end region 141) of the substrate upper surface 110.
[0037]The first substrate 100 may be a circuit board, for example, a printed circuit board (PCB) or a flexible PCB that may be easily modified, wherein the first substrate 100 may be formed of (e.g., may at least partially comprise) an organic resin material containing epoxy, triazine, silicon, and polyimide; and other organic resin material. In some example embodiments, the first substrate 100 may include a silicon nitride layer, a ceramic material such as AlN or Al2O3, or a metal or a metal compound such as metal core printed circuit board (MCPCB) or metal-based copper clad laminate (MCCL).
[0038]The first substrate 100 may have a solid or flexible plate structure in a long rectangular shape having a particular (or, alternatively, predetermined) length L1 in a longitudinal direction (a first direction). For example, the first substrate 100 may have a structure which is compliant with the Zhaga standards for a module.
[0039]In some example embodiments, electrically connected portions may, for example, serve as an upper part protection layer as an insulating layer is formed on the entire surface of the substrate upper surface 110 except on the first connection pads 130 and the connectors 140.
[0040]The first substrate 100 may be a single layer circuit board having interconnections on one surface. That is, interconnections for the first connection pads 130 and the connectors 140 are formed only on the substrate upper surface 110, and a lower surface of the first substrate 100 may have no interconnection formed thereon. Using a single layer circuit board as the first substrate 100 may be economically preferable in terms of the manufacturing cost compared to using a double layer circuit board as the first substrate 100 because the cost of manufacturing a single layer circuit board is lower than the cost of manufacturing a double layer circuit board.
[0041]The first substrate 100 is not limited to a structure or a material of the substrates described above. For example, the first substrate 100 may be formed of (e.g., may at least partially comprise) a metal material such that the first substrate 100 is configured to have improved heat-releasing characteristics.
[0042]The first substrate 100 may include a plurality of first mounting elements 120 extending along a longitudinal axis of the first substrate 100 (e.g., extending in a longitudinal direction (a first direction)). The first mounting elements 120 may be in a plural number (“quantity”) on the substrate upper surface100 along a longitudinal axis of the first substrate 100. Each of the first mounting elements 120 may include a plurality of first connection pads 130 each located in an area that is proximate to at least one end of both ends of the first mounting element 120. The first mounting elements 120 may be configured to couple with a second substrate 200 (see FIG. 2), as described later. A mounting element 120 may include one or more connection elements configured to engage with at least a portion of a second substrate 200 to connect with the second substrate 200. A second substrate 200 may be mounted on a mounting element 120. A mounting element 120 and may be defined by division lines, as shown in FIG. 1, or may not be defined by division lines.
[0043]The connectors 140 are equipped for transmitting (e.g., are configured to supply) electrical signals to the outside (e.g., one or more elements that are external to the first substrate 100) and/or for power supply (e.g., configured to supply and/or receive electrical power) and at least one of the connectors 140 may be positioned around at least one of both ends of the substrate upper surface 110. In FIG. 1, the connectors 140 are positioned in an end region 141 of the first substrate 100, where the end region 141 is proximate to one end of the substrate upper surface 110, but embodiments are not limited thereto, and the connectors 140 may be positioned around each of both ends of the substrate upper surface 110. The connectors 140 may include an external connection terminal for supplying power to a light-emitting device 300 (see FIG. 4), as described later, through the first connection pads 130 of each of the first mounting elements 120. The connectors 140 may each include a positive electrode connector 140p that is connected to a positive electrode power source; and a negative electrode connector 140n that is connected to a negative electrode power. The connectors 140 may be configured to be electrically connected to the first connection pads 130. Similarly, the first connection pads 130 may be configured to be electrically connected to the plurality of connectors 140.
[0044]In some example embodiments, the first substrate 100 may be a substrate of a light source module of a backlight assembly (e.g., may be configured to be a substrate of a light source module of a backlight assembly). In some example embodiments, the first substrate 100 may include a coupling unit 150 to which a backlight assembly of a light source is mounted, and the coupling unit 150 may be, for example, grooves formed in a side surface of the first substrate 100.
[0045]FIG. 2 is a perspective view that illustrates a second substrate 200 of a light source module according to some example embodiments.
[0046]Referring to FIG. 2, the second substrate 200 may have a bar shape that extends to a particular (or, alternatively, predetermined) length L2 along a longitudinal axis of the second substrate 200 (e.g., in a longitudinal direction (a first direction) of the second substrate 200).
[0047]The second substrate 200 may include a plurality of second mounting elements 220 positioned on a substrate upper surface 210; and a plurality of upper connection pads 230 positioned in the second mounting elements 220. A mounting element 220 may include one or more connection elements configured to engage with at least a portion of a light-emitting device to connect with the light-emitting device.
[0048]The second substrate 200 may be a circuit board, for example, a PCB. If and/or when the second substrate 200 is a PCB, a body layer may be generally prepared by compressing a polymer material such as a thermosetting resin, an epoxy-based resin or a phenol resin such as Flame Retardant 4 (FR-4), Bismaleimide Triazine (BT), or Ajinomoto Build up Film (ABF) in a constant thickness to form a thin film, coating both surfaces of the thin film with a copper foil, and forming an interconnection pattern, which becomes a transmission pathway of an electrical signal by the patterning process.
[0049]In some example embodiments, the second substrate 200 may have interconnection patterns in the substrate upper surface 210 and a substrate lower surface 215 (see FIG. 3) that may be electrically connected to each other by vias that are formed through the body layer (e.g., extend at least partially through the body layer). Coating a whole lower surface and a whole upper surface of the body layer with a solder resist, except the electrically connected regions, for example, connection pads and external connection members, may form a lower protection layer and an upper protection layer.
[0050]The second substrate 200 may be a double layer PCB. That is, interconnections for the upper connection pads 230 for electrical connection with a plurality of light-emitting devices 300 (see FIG. 4) may be formed on the substrate upper surface 210, and interconnections for a second connection pad 240 (see FIG. 3) for electrical connection with the first substrate 100 may be formed on the substrate lower surface 215.
[0051]In some example embodiments, the number (“quantity”) of layers of the copper film may be 3 or more by using prepreg, which is an insulating material, and when 3 or more interconnection layers are formed on the corresponding number of layers of the copper film, a multi-layered wiring PCB may be manufactured. However, the second substrate 200 is not limited a structure or a material of the PCB described above. For example, the second substrate 200 may be MCPCB, MPCB, or FPCB.
[0052]The second substrate 200 may be a PCB having a relatively short length which may be a particular (or, alternatively, predetermined) length L2 in a longitudinal direction (a first direction) of the second substrate 200 (e.g., along a longitudinal axis of the second substrate 200). The length L2 of the second substrate 200 may be shorter than the length L1 of the first substrate 100. For convenience of description, a width and a thickness of the second substrate 200 in FIG. 2 are different from a width and a thickness of the first substrate 100 in FIG. 1, but a width and a thickness of the second substrate 200 may be substantially the same as a width and a thickness of the first substrate 100, respectively.
[0053]The second substrate 200 may include a plurality of second mounting elements 220. The second mounting elements 220 may be in a plural number (“quantity”) on the substrate upper surface 210 and the plurality of mounting elements may extend along the longitudinal axis of the second substrate 200 (e.g., in a longitudinal direction of the second substrate 200). Each of the second mounting elements 220 may include upper connection pads 230 each positioned around each of both ends thereof. The second mounting elements 220 may be configured to connect with separate light-emitting devices 300, as described later. Each mounting element 220 may be configured to enable a light-emitting device 300 to be mounted on the mounting element 220 and may be defined by division lines, as shown in FIG. 1, or may not be defined by division lines. Although it will be described later, the division lines may be formed by a protrusion unit 410 (see FIG. 9).
[0054]FIG. 3 is a bottom plan view that illustrates a lower surface of the second substrate 200 of a light source module according to some example embodiments.
[0055]Referring to FIG. 3, the substrate lower surface 215 of the second substrate 200 may include a second connection pad 240 via which the first substrate 100 may be electrically connected (see FIG. 1). The second connection pads 240 may be configured to be electrically coupled to one or more of the upper connection pads 230 of the mounting elements 220, such that the second connection pads 240 may be configured to be electrically coupled to one or more of the mounting elements 220.
[0056]As described above, the second substrate 200 may be a double layer PCB having interconnections on both surfaces, and the interconnections formed on the substrate lower surface 215 of the second substrate 200 connect the first substrate 100 with the outside.
[0057]The second connection pads 240 may be configured to be electrically connected to the first connection pads 130 of the first substrate 100 (see FIG. 1). The second connection pads 240 may each include a second positive electrode connection pad 240p that is configured to be electrically connected to a positive electrode power source; and a second negative electrode connection pad 240n that is configured to be electrically connected to a negative electrode power source. A plurality of second connection members 250 (see FIG. 8) such as solder balls or solder bumps may be mounted on the second connection pads 240.
[0058]The second connection pads 240 may be a metal layer of gold (Au), copper (Cu), silver (Ag), or aluminum (Al). For example, the second connection pads 240 may be formed of a conductive material including copper (Cu). In this case, when the copper (Cu) in the second connection pads 240 is exposed to air, an oxidation layer may be formed on surfaces of the second connection pads 240, which disturb soldering, and thus solder balls or solder bumps may not be properly mounted on the second connection pads 240 of the second substrate 200. Thus, in order to mount solder balls or solder bumps on the second connection pads 240 without defects, the second connection pads 240 may be surface-treated for preventing formation of an oxidation layer.
[0059]FIG. 4 is a schematic perspective view that illustrates a plurality of light-emitting devices 300 mounted on an upper surface of the second substrate 200 of a light source module according to some example embodiments.
[0060]Referring to FIG. 4, the light-emitting devices 300 may be mounted in the second mounting elements 220 that are defined on the substrate upper surface 210 of the second substrate 200.
[0061]In some example embodiments, the light-emitting device 300 may be in a plural number (“quantity”), and thus a plurality of the light-emitting devices 300 may be separately arranged in a row at a constant or substantially constant interval (e.g., a constant interval within manufacturing tolerances and/or material tolerances) on the substrate upper surface 210 of the second substrate 200. In some example embodiments, a plurality of the light-emitting devices 300 may be arranged in a plurality of rows. In some example embodiments, a plurality of the light-emitting devices 300 may be arranged in a line, in a curve, or in a particular (or, alternatively, predetermined) pattern. As shown in FIG. 4, the mounting elements 220 may extend along a longitudinal axis of the second substrate 200, such that the plurality of light-emitting devices 300 may extend along the longitudinal axis of the second substrate.
[0062]The light-emitting devices 300 may be electrically connected to the upper connection pads 230 (see FIG. 2) in the second substrate 200. The light-emitting device 300 may be any light-emitting device that is configured to generate light of a particular (or, alternatively, predetermined) wavelength by externally supplied driving power. A light-emitting device 300 may include one or more light-emitting diodes (LEDs). The light-emitting device 300 may include multiple light-emitting devices, as described later with reference to FIGS. 5 to 7.
[0063]More details about the light-emitting device 300 will be described later. A light-emitting device 300 may be configured to emit blue light, green light, or red light based on one or more materials and/or one or more fluorescent materials included in the light-emitting device 300. In some example embodiments, a light-emitting device may be configured to emit white light and/or UV light.
[0064]In FIG. 4, the light-emitting devices 300 are each mounted on a separate one of the second mounting elements 220. However, example embodiments are not limited thereto, and a plurality of the light-emitting devices 300 may be mounted on each of the second mounting elements 220. In some example embodiments, all light-emitting devices 300 may be mounted on one second mounting element 220.
[0065]FIG. 5, FIG. 6, and FIG. 7 are each a cross-sectional view that illustrates a light-emitting device that may be included in a light source module according to some example embodiments.
[0066]Referring to FIG. 5, the light-emitting device 300 may include a plurality of first conductive semiconductor layers 310 that are sequentially stacked on a supporting substrate 301; an active layer 330; a plurality of second conductive semiconductor layers 320; a first electrode pad 340a; and a second electrode pad 340b.
[0067]The plurality of first conductive semiconductor layers 310 that are sequentially stacked on the supporting substrate 301 may be an n-type nitride semiconductor layer doped with an n-type impurity. In some example embodiments, the plurality of second conductive semiconductor layers 320 may be a p-type nitride semiconductor layer doped with a p-type impurity. However, in some example embodiments, the positions of the first and second conductive semiconductor layers 310 and 320 may be switched with each other. The first and second conductive semiconductor layers 310 and 320 may have a formula of AlxInyGa(1-x-y)N (where 0≦x<1, 0≦y<1, and 0≦x+y<1), and examples of a material for the first and second conductive semiconductor layers 310 and 320 may include GaN, AlGaN, InGaN, and AlInGaN.
[0068]The active layer 330 disposed between the first and second conductive semiconductor layers 310 and 320 may emit light having particular (or, alternatively, predetermined) energy due to recombination of electrons and holes. The active layer 330 may include a material having an energy band gap that is less than an energy band gap of the first and second conductive semiconductor layers 310 and 320. For example, when the first and second conductive semiconductor layers 310 and 320 are a GaN-based compound semiconductor, the active layer 330 may include an InGaN-based compound semiconductor having an energy band gap that is less than an energy band gap of GaN.
[0069]In some example embodiments, the active layer 330 may have a multiple quantum well structure, for example, an InGaN/GaN structure, in which quantum well layers and quantum barrier layers are alternately stacked. However, example embodiments are not limited thereto, and the active layer 330 may have a single quantum well structure.
[0070]The light-emitting device 300 may include the first and second electrode pads 340a and 340b that are configured to be electrically connected to the first and second conductive semiconductor layers 310 and 320, respectively. In some example embodiments, in order to manufacture a structure of a chip on board type by flip-chip bonding, the first and second electrode pads 340a and 340b may be exposed and disposed in the same direction on one surface of the light-emitting device 300. Here, the one surface of the light-emitting device 300 may be defined as a mounting surface on which the light-emitting device 300 is subjected to be mounted on the second substrate 200 (see FIG. 4).
[0071]Referring to FIG. 6, the light-emitting device 300-1 may include a semiconductor stack structure on a supporting substrate 301. The semiconductor stack structure may include a first conductive semiconductor layer 310, an active layer 330, and a second conductive semiconductor layer 320.
[0072]The light-emitting device 300-1 includes the first and second electrode pads 340a and 340b that are electrically connected to the first and second conductive semiconductor layers 310 and 320, respectively. The first electrode pad 340a may include a conductive via 340ax that is electrically connected to the first conductive semiconductor layer 310 through the second conductive semiconductor layer 320 and the active layer 330; and an electrode extension 340ay that is connected to the conductive via 340ax.
[0073]The conductive via 340ax may be surrounded by an insulating layer 350 and thus may be electrically separated from the second conductive semiconductor layer 320. The conductive via 340ax may be formed in an area where the semiconductor stack structure is etched. The number, shape, pitch, or contact area of conductive vias 340ax may be appropriately designed with respect to the first conducive semiconductor layer 310 to decrease contact resistance. In some example embodiments, the conductive vias 340ax may be arranged in rows and columns on the semiconductor stack structure to increase current flow. The second electrode pad 340b may include an ohmic contact layer 340bx and an electrode extension 340by on the second conductive semiconductor layer 320.
[0074]Referring to FIG. 7, the light-emitting device 300-2 may include a supporting substrate 301; a first conductive base layer 302 disposed on the supporting substrate 301; a plurality of nano light-emitting structures 360 disposed on the first conductive base layer 302; an insulating layer 303, and a filling 304.
[0075]Each of the nano light-emitting structures 360 includes a first conductive semiconductor core 361; and an active layer 362 and a second conductive semiconductor layer 363 that are sequentially stacked as shell layers on a surface of the first conductive semiconductor core 361.
[0076]In some example embodiments, the nano light-emitting structures 360 have a core-shell structure as an example. However, example embodiments are not limited thereto, and the nano light-emitting structures 360 may have a different structure such as a pyramid structure. The first conductive semiconductor base layer 302 may be a layer that provides a growing surface of the nano light-emitting structures 360. The insulating layer 303 provides an open area for growth of the nano light-emitting structures 360, and the insulating layer 303 may be formed of a dielectric material such as a silicon oxide layer, a silicon nitride layer, or a silicon nitrate layer.
[0077]The filling 304 may structurally stabilize the nano light-emitting structure 360 and may transmit or reflect light. When the filling 304 includes a light-permeable material, the filling 304 may be a transparent material such as a silicon oxide layer, a silicon nitride layer, a silicon nitrate layer, an elastic resin, silicon, an epoxy resin, a polymer, or plastic. In some example embodiments, when the filling 304 includes a reflective material, the filling 304 may be prepared by using metal powder or ceramic powder having high reflectivity in a polymer material such as polyphthalamide (PPA). The ceramic powder having high reflectivity may be at least one selected from the group consisting of TiO2, Al2O3, Nb2O5, Al2O3, and ZnO. In some example embodiments, a highly reflective metal may be used to prepare the filling 304, and an example of the highly reflective metal may be aluminum (Al) or silver (Ag).
[0078]The first and second electrode pads 340a and 340b may be disposed on an upper surface of the nano light-emitting structures 360. The first electrode pad 340a may be positioned on an exposed upper surface of the first conductive semiconductor base layer 302, and the second electrode pad 340b may include an ohmic contact layer 340bs and an electrode extension 340by on the nano light-emitting structures 360 and the filling 304. In some example embodiments, the ohmic contact layer 340bx and the electrode extension 340by may be integrated to one body.
[0079]FIG. 8 and FIG. 9 are each a cross-sectional view that illustrates a light-emitting device mounted on the upper surface of the second substrate of a light source module according to some example embodiments.
[0080]Referring to FIG. 8, first connection members 370 are mounted on the substrate upper surface 210 of the second substrate 200 so that the upper connection pads 230 and the light-emitting device 300 are electrically connected through the first connection members 370, and the second connection members 250 are on the second connection pads 240 of the substrate lower surface 215 of the second substrate 200.
[0081]The light-emitting device 300 may include electrode pads 340a and 340b that are configured to be electrically connected to the first and second conductive semiconductor layers 310 and 320, respectively. The light-emitting device 300 may be mounted on and thus may be electrically connected to the second substrate 200 through the first connection members 370, or, for example, solder balls or solder bumps, that connect the electrode pads 340a and 340b and the upper connection pads 230 by flip-chip bonding.
[0082]A cross-sectional view of the second substrate 200 is a cross-sectional view of a double layer PCB, in which the upper connection pads 230 overlap vias 235, and the second connection pads 240, on which the second connection members 250 are positioned, overlap the vias 235 therebelow. For example, the upper connection pads 230, the vias 235, and the second connection pads 240 are sequentially stacked on an insulating layer. The upper connection pads 230 and the second connection pads 240 are configured to be electrically connected to each other by the vias 235. In some example embodiments, after exposing only connection areas, the upper connection pads 230 and the second connection pads 240 are each covered by a solder resist. The exposed connection areas of the second connection pads 240 are areas where the second connection members 250 such as solder balls or solder bumps are attached thereon after the surface treatment, and the exposed connection areas of the upper connection pads 230 are areas where the first connection members 370 such as solder balls or solder bumps are attached thereon after the surface treatment.
[0083]A size of the first connection members 370 may be less than a size of the second connection members 250. Therefore, the exposed connection areas of the upper connection pads 230 may be smaller than the exposed connection areas of the second connection pads 240. Despite the difference in the sizes of the exposed connection areas, the upper connection pads 230 and the second connection pads 240 may perform the same function.
[0084]Although FIG. 8 shows a PCB having two metal layers, the number of metal layers may be at least 3 or 4 depending on the need, and thus the PCB may have a further complicated structure.
[0085]Referring to FIG. 9, protruding units 410 and resin units 420 fill a space between the light-emitting device 300 and the second substrate 200.
[0086]The resin units 420 are formed when a resin contains a high thermal conductive filler or a high light-reflective filler or when a high thermal conductive filler or a high light-reflective filler are contained in a resin. In some example embodiments, the resin units 420 may fill a space between the light-emitting device 300 and the second substrate 200 by an underfill process.
[0087]In some example embodiments, the protruding units 410 may be on the substrate upper surface 210 of the second substrate 200 and define areas on which the resin units 420 are formed. Therefore, the resin units 420 that fill the space between the light-emitting device 300 and the second substrate 200 by an underfill process may not overflow to the outside and may be formed within the area limited by the protruding units 410. Starting parts and ending parts of the protruding units 410 may contact each other so that the resin units 420 do not leak out of the protruding units 410. That is, the protruding units 410 may have a shape of a closed curve. In some example embodiments, the protruding units 410 may define the second mounting elements 220 (see FIG. 2).
[0088]FIG. 10 is a perspective view that illustrates mounting of a plurality of second substrates 200 on an upper surface of the first substrate 100 of a light source module according to some example embodiments.
[0089]Referring to FIG. 10, in order to manufacture a light source module, a plurality of second substrates 200 having a plurality of light-emitting devices 300 equipped thereon may be mounted on an upper surface 110 of a first substrate 100 having circuit interconnections formed thereon by using surface mounting technology in a longitudinal direction of the first substrate 100.
[0090]The surface mounting technology may include a fluxing process, a mounting process, a reflow process, and an underfill process. Flux is coated on the second connection members 250 (see FIG. 12) respectively formed on the second connection pads 240 (see FIG. 12) of the second substrate 200 through the fluxing process. The second substrate 200 including the flux coated second connection members 250 is mounted on the first substrate 100 through the mounting process. During the mounting process, the second connection members 250 are exactly connected with the first connection pads 130 on the substrate upper surface 110 of the first substrate 100 and the second substrate 200 is mounted within the first mounting element 120.
[0091]After mounting each of the second substrates 200 on the first substrate 100, the second connection members 250 may be chemically bonded with the first connection pads 130 through a reflow process. The reflow process may include a process of heating the second connection members 250 to a melting temperature of a material forming the second connection members 250 or higher. The second connection members 250 may each form an intermetallic compound with the first connection pad 130 through a reflow process and thus may form a further stable bond.
[0092]Since the second substrate 200 is mounted on the first substrate 100 by using surface mounting technology, a mounting margin may be reduced than when the second substrate 200 is mounted on the first substrate 100 by using bonding interconnection technology or connection technology using interconnections that are generally used in the art. In some example embodiments, a manufacturing task may be performed by using a surface mounting apparatus used in the manufacture of a semiconductor, and thus manufacturing efficiency may increase and a defect ratio may decrease.
[0093]In FIG. 10, the second substrates 200 are mounted on the first substrate 100 one at a time. However, example embodiments are not limited thereto, and a plurality of the second substrates 200 may be mounted on the first substrate 100 at once. In some example embodiments, FIG. 10 shows that three of the second substrates 200 are mounted on the first substrate 100, but embodiments are not limited thereto, and at least two or four second substrates 200 may be mounted on the first substrate 100.
[0094]FIG. 11 is a plan view that illustrates the plurality of second substrates 200 mounted on the upper surface of the first substrate 100 of a light source module according to some example embodiments.
[0095]Referring to FIG. 11, the second substrates 200 equipped with the light-emitting device 300 are mounted on the substrate upper surface 110 of the first substrate 100 in a longitudinal direction of the first substrate 100, and thus a light source module having a long length along its respective longitudinal axis is prepared.
[0096]According to some example embodiments, provided is a long-axis light source module that is prepared by mounting the light-emitting devices 300 on the second substrates 200, which are a double layer PCB having a relatively short length along a respective longitudinal axis in the form of a chip, by using flip-chip bonding technology and mounting the second substrates 200 on the first substrate 100 having a relatively long length along a respective longitudinal axis by using surface mounting technology.
[0097]Display devices such as a TV, a monitor, and a touch panel have been manufactured in large sizes, and thus a light source module and a backlight assembly having high light intensity and high efficiency is needed in the market. In some example embodiments, according to an increased application of light-emitting devices in a lighting device, line-emission or surface-emission of a large surface area is needed.
[0098]In order to be used as a component of a large-sized display device or a large-sized lighting device, a light source module having a long length along its respective longitudinal axis with a plurality of light-emitting devices mounted thereon is preferable in terms of manufacturing efficiency. However, a conventional process apparatus capable of performing a surface mounting process has low accuracy to manufacture a light source module having a long length along its respective longitudinal axis, and manufacturing a process apparatus for a light source module having a long length along its respective longitudinal axis requires a high cost. That is, a light source module having a short length along its respective longitudinal axis may be manufactu