具体实施方式：
[0026]Reference will now be made in detail to the embodiments of the present disclosure, examples of which are shown in the accompanying drawings. In the following description, it will be understood that when a layer (or film) is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Further, it will be understood that when a layer is referred to as being “under” another layer, it can be directly under the other layer, and one or more intervening layers may also be present. In addition, it will also be understood that when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. In the figures, the dimensions of layers and regions are exaggerated for clarity of illustration. In addition, the dimension of each part does not reflect an actual size.
[0027]FIG. 1 is a plane view of a light emitting device according to a first embodiment, FIG. 2 is a cross-sectional view of a light emitting device according to the first embodiment, and FIG. 3 is a cross-sectional view of a light emitting device according to a second embodiment and exemplarily shows that the current embodiment is applied to a lead frame package type light emitting device.
[0028]As shown in FIGS. 1 and 2, a light emitting device 100 according to the first embodiment includes a body 120 having a cavity 113, a first electrode 130 and a second electrode 132 disposed in the body 120, and a heat radiation member 110 having inclination surfaces for mounting a plurality of light emitting diodes 140, 150 in the cavity 113 and thermally connected to the light emitting diodes 140, 150. The heat radiation member is formed within and exposed through an opening in the body.
[0029]Herein, the cavity 113 in which the light emitting device 100 is mounted may be sealed by using a sealant (not shown).
[0030]The cavity 113 in which the light emitting diodes 140, 150 are mounted may be formed at an upper portion of the body 120. The body 120 may be formed of various materials such as ceramic, silicon, resin, etc. The body 120 may be formed in a single body structure using an injection molding, or in a multi-layered structure.
[0031]The cavity 113 may be formed in a concave container shape, such as a cup shape, a polygonal shape, an elliptical shape, a circular shape, etc. Herein, a circumferential surface of the cavity 113 may be formed vertically or with a predetermined slope in consideration of distribution angles of the mounted light emitting diodes 140, 150. A surface of the cavity 113 may be coated or deposited with a high reflectivity material, for example, white photo solder resist (PSR) ink, silver (Ag), aluminum (Al) or the like, so that the luminous efficiency of the light emitting device 100 can be enhanced.
[0032]One terminals of the first and second electrodes 130 and 132 may be electrically connected to the light emitting diodes 140 and 150, respectively, and the other terminals may be electrically connected to a substrate (not shown) on which the light emitting device 100 is mounted, to supply power to the light emitting diodes 140 and 150. Therefore, the first and second electrodes 130 and 132 may be formed such that one terminals are disposed inside the body 120 on which the light emitting diodes 140 and 150 are mounted, and the other terminals are exposed to an outer lower side of the body 120. While the present embodiment exemplarily shows and describes that two electrodes 130 and 132 are formed, it is to be understood that two or more electrodes may be formed according to the number of the light emitting diodes. Also, the first and second electrodes 130 and 132 may be modified in various shapes, such as a shape enclosing the body 120 or in a shape the other terminals of which are branched. The light emitting diodes 140 and 150 may be provided in a structure in which light emitting chips 142 and 152 are formed on dies 144 and 154, respectively. Each of the light emitting diodes 140 and 150 may be at least one of a red light emitting diode emitting red light, a green light emitting diode emitting green light, and a blue light emitting diode emitting blue light, and is not limited thereto. In this embodiment, since the light emitting diodes 140, 150 are two or more, it is also possible to apply the light emitting diodes 140, 150 each emitting a different color light.
[0033]The heat shielding member 110 is formed of material such as metal, resin or the like having a good thermal conductivity, and is thermally connected to the light emitting diodes 140, 150. At an upper portion of the heat shielding member 110, a first mounting part 115 having an inclination surface on which the first light emitting diode 140 is mounted, and a second mounting part 117 having an inclination surface on which the second light emitting diode 150 is mounted, may be formed.
[0034]As shown in FIG. 1, the first mounting part 115 and the second mounting part 117 may be arranged in a diagonal direction on a parallel line having a spacing distance D. Thus, in the case where the first mounting part 115 and the second mounting part 117 may be arranged in a diagonal direction, the spacing distance D between the first light emitting diode 140 and the second light emitting diode 150 can be maximized, so that heat generated from each of the first and second light emitting diodes 140, 150 can be effectively radiated. These mounting parts 115, 117 may be formed by two or more mounting parts according to the number of light emitting diodes which are being mounted, and may be arranged in various configurations in consideration of the orientation angle and heat radiation characteristic.
[0035]Meanwhile, in the light emitting device 100 according to the first embodiment exemplarily shown in FIG. 2, the first mounting part 115 and the second mounting part 117 are formed spaced apart from each other, whereas in the light emitting device 100 according to a second embodiment exemplarily shown in FIG. 3, the first mounting part 115 and the second mounting part 117 are formed without a spacing therebetween.
[0036]In the light emitting device 100 according to the first embodiment exemplarily shown in FIG. 2, the inclination surface of the first mounting part 115 is formed in the left (L) direction, and the inclination surface of the second mounting part 117 is formed in the right (R) direction. Therefore, when the light emitting diodes 140, 150 are mounted on the mounting parts 115 and 117, respectively, the direction of light emitted from the first light emitting diode 140 is inclined in the left (L) direction with respect to a center line, and the direction of light emitted from the second light emitting diode 150 is inclined in the right (R) direction with respect to the center line. Herein, as the slopes a and p of the first and second mounting parts 115 and 117 increase, the orientation angles of the lights emitted from the first and second light emitting diodes 140, 150 are directed toward the left (L) or right (R) direction from the center line. Therefore, by adjusting the slopes α and β of the first and second mounting parts 115, 117, it is possible to adjust the orientation angle at a desired angle.
[0037]Meanwhile, the light emitting device 100 according to the second embodiment shown in FIG. 3 has the same constitution that the first and second mounting parts 115 and 117 are respectively formed with inclination surfaces having the corresponding slopes α and β, as the light emitting device according to the first embodiment shown in FIG. 2 except that there is no spacing between the first mounting part 115 and the second mounting part 117. That is, the first mounting part 115 and the second mounting part 117 may be arranged on the same line or may be arranged at positions parallel to each other but without a spacing therebetween. Thus, in the case where there is no spacing between the first and second mounting parts 115 and 117, it is possible to adjust the orientation angle of the light emitting device 100 by adjusting the tile angles α and β of the first and second mounting parts 115 and 117.
[0038]FIG. 4 is a cross-sectional view of a light emitting device according to a third embodiment, and FIG. 5 is a cross-sectional view of a light emitting device according to a fourth embodiment. FIGS. 3 and 4 exemplarily show that the current embodiment is applied to a lead frame package type light emitting devices. In describing the third and fourth embodiments, the same constitutions as those in the first and second embodiments will be referred from the previous description and thus the repeated description will be omitted.
[0039]Each of light emitting devices 100 according to the third and fourth embodiments includes a body 120, a first electrode 130 and a second electrode 132 disposed inside the body 120 and electrically connected to light emitting devices 140 and 150, a heat radiation member 110 having inclination surfaces for mounting light emitting diodes 140, 150 in the cavity 113 and thermally connected to the light emitting diodes 140, 150, and a lens part 160 formed at a light emitting region of the body 120 on which the light emitting diodes 140, 150 are mounted, scattering or focusing light.
[0040]The cavity 113 may be sealed by using a transparent sealant (not shown). A fluorescent material for converting light emitted from the light emitting diodes 140, 150 to a light having a predetermined color may be added to the transparent sealant.
[0041]The lens part 160 may be disposed on the light emitting diodes 140, 150 to change the orientation angle of the light emitted from the light emitting diodes 140, 150. The lens part 160 may be disposed directly in contact with the light emitting diodes 140, 150 or apart from the light emitting diodes 140, 150, and has a shape for scattering or focusing light. For example, the lens part 160 may be formed in various shapes, such as a semispherical shape an upper surface of which is convex, or in a shape having a convex upper surface and a concave portion formed in the convex upper surface. Also, according to the directions and slopes of the inclination surfaces on which the light emitting diodes 140, 150 are mounted, the lens part 160 may be formed in a asymmetric semispherical shape in which only a region corresponding to the light emitting region is protruded or recessed. The lens part 160 may be formed of a material including a transparent resin material such as silicon or epoxy, and may include a fluorescent material at least a portion thereof.
[0042]Therefore, lights emitted from the light emitting diodes 140, 150 mounted on the mounting parts 115, 117 may be scattered or focused by the lens part 160 and then emitted.
[0043]FIG. 6 is a cross-sectional view of a light emitting device according to a fifth embodiment, and FIG. 7 is a cross-sectional view of a light emitting device according to a sixth embodiment. FIGS. 6 and 7 exemplarily show that the current embodiments are applied to wafer level package type light emitting devices.
[0044]As shown in FIG. 6, the light emitting device 100 according to the fifth embodiment includes a body 210 having a cavity 213, an insulating layer 212 on a surface of the body 210, first electrode 130 and second electrode 132 on the body 210, a reflective layer 230 formed on at least some region of the insulating layer, reflecting light, and mounting parts 215, 217 providing inclination surfaces for mounting light emitting diodes 240, 250. The cavity 213 in which the light emitting diodes 240, 250 are mounted may be sealed by using a sealant (not shown).
[0045]The cavity 213 in which the light emitting devices 240, 250 are mounted may be formed at an upper portion of the body 210. The body 210 may be formed of various materials such as silicon (Si), aluminum (Al), aluminum nitride (AlN), aluminum oxide (AlOx), photo sensitive glass (PSG), sapphire (Al2O3), beryllium oxide (BeO), or the like.
[0046]The cavity 213 may be formed in a concave container shape, such as a cup shape, a polygonal shape, an elliptical shape, a circular shape, etc. Herein, a circumferential surface of the cavity 213 may be formed vertically or with a predetermined slope in consideration of distribution angles of lights emitted from the mounted light emitting diodes 240, 250. The cavity 213 may be formed with various methods according to the material of the body 210. For example, when the body 210 is formed of silicon (Si), the cavity 213 may be formed by performing a wet etching.
[0047]The insulating layer 212 prevents the body 210 from being electrically shorted to the first and second electrodes 220, 222, the reflective layer 230, an external power, or the like. The insulating layer 212 may be formed of at least one of silicon oxide (SiO2, SixOy), silicon nitride (Si3N4, SixNy), silicon oxynitride (SiOxNy), and aluminum oxide (Al2O3), preferably, silicon oxide (SiO2, SixOy), but the invention is not limited thereto. Also, in the case where the body 210 is formed of insulator such as aluminum nitride (AlN), aluminum oxide (AlOx), or the like, the insulating layer 212 may not be formed.
[0048]The first electrode 220 and the second electrode 222 may be formed on the insulating layer 212 to supply power to the light emitting devices 240, 250. The first electrode 220 and the second electrode 222 may be formed separately as a positive electrode and a negative electrode, and may be formed in two or more electrodes.
[0049]The reflective layer 230 may be formed at a position capable of efficiently reflecting lights emitted from the light emitting diodes 240, 250, for example, inside the cavity 213 of the body 210, but the invention is not limited thereto. The reflective layer 230 may have a multi-layer structure, for example, a Ti/Ag structure including a titanium (Ti) layer and a silver (Ag) layer stacked sequentially.
[0050]The light emitting diodes 240 and 250 may be provided in a structure in which light emitting chips 242 and 252 are formed on dies 244 and 254, respectively. Each of the light emitting diodes 240 and 250 may be at least one of a red light emitting diode emitting red light, a green light emitting diode emitting green light, and a blue light emitting diode emitting blue light, but the invention is not limited thereto. In this embodiment, since the light emitting diodes 240 and 250 are two or more, it is also possible to apply the light emitting diodes 240, 250 each emitting a different color light.
[0051]Mounting parts 215 and 217 for mounting the light emitting diodes 240 and 250 are formed on the insulating layer 212. By mounting the light emitting diodes 240 and 250 on the mounting parts 215 and 217, respectively, the light emitting diodes 240 and 250 are fixed with a slope according to the slopes α and β of the mounting parts 215 and 217. Accordingly, the orientation angle of the light emitting device 200 varies with the mounting angle of each of the light emitting diodes 240 and 250.
[0052]The mounting parts 215, 217 may be formed by two or more mounting parts according to the number of light emitting diodes which are being mounted, and may be arranged in various configurations in consideration of the orientation angle and heat radiation characteristic. The current embodiment exemplarily shows that the first light emitting diode 240 is mounted on the inclination surface of the first mounting part 215 and the second light emitting diode 250 is mounted on the inclination surface of the second mounting part 217.
[0053]For example, the inclination surface of the first mounting part 215 may be formed in the left (L) direction, and the inclination surface of the second mounting part 217 may be formed in the right (R) direction. Therefore, when the light emitting diodes 240 and 250 are mounted on the mounting parts 215 and 217, respectively, the direction of light emitted from the first light emitting diode 240 is inclined in the left (L) direction with respect to a center line, and the direction of light emitted from the second light emitting diode 250 is inclined in the right (R) direction with respect to the center line. Herein, as the slopes α and β of the mounting parts 215 and 217 increase, the orientation angles of the lights emitted from the first and second light emitting diodes 240 and 250 are directed toward the left (L) or right (R) direction from the center line. Therefore, by adjusting the slopes α and β of the mounting parts 215 and 217, it is possible to adjust the orientation angle at a desired angle.
[0054]FIG. 7 is a cross-sectional view of a light emitting device according to a sixth embodiment, and exemplarily shows a wafer level package type light emitting device. In describing the sixth embodiment, the same constitution as that in the third embodiment will be referred from the previous description and thus the repeated description will be omitted.
[0055]The light emitting device 200 according to the sixth embodiment includes mounting parts 215 and 217 providing inclination surfaces for mounting plural light emitting diodes 240 and 250 in a cavity of a body 210, and a lens part 260 formed at a light emitting region of the cavity 213 in which the light emitting diodes 240 and 250 are mounted, scattering or focusing light.
[0056]The cavity 213 may be sealed by using a transparent sealant (not shown). A fluorescent material for converting light emitted from the light emitting diodes 240 and 250 to a light having a predetermined color may be added to the transparent sealant.
[0057]The lens part 260 may be disposed on the light emitting diodes 240 and 250 to change the orientation angles of lights emitted from the light emitting diodes 240 and 250. The lens part 260 may be disposed directly in contact with the light emitting diodes 240 and 250 or apart from the light emitting diodes 240 and 250, and has a shape for scattering or focusing light. For example, the lens part 260 may be formed in various shapes, such as a semispherical shape an upper surface of which is convex, or in a shape having a convex upper surface and a concave portion formed in the convex upper surface. Also, according to the directions and slopes of the inclination surfaces on which the light emitting diodes 240 and 250 are mounted, the lens part 260 may be also formed in a asymmetric semispherical shape in which only a region corresponding to the light emitting region is protruded or recessed. The lens part 260 may be formed of a material including a transparent resin material such as silicon or epoxy, and may include a fluorescent material at least a portion thereof.
[0058]The light emitting device 200 according to the sixth embodiment exemplarily shows that the inclination surface of the first mounting part 215 is formed in the left (L) direction and the inclination surface of the second mounting part 217 is formed in the right (R) direction. Therefore, when the light emitting diodes 240 and 250 are mounted on the mounting parts 215 and 217, respectively, the direction of light emitted from the first light emitting diode 240 is inclined in the left (L) direction with respect to a center line, and the direction of light emitted from the second light emitting diode 250 is inclined in the right (R) direction with respect to the center line.
[0059]The lights emitted from the light emitting diodes 240 and 250 mounted on the mounting parts 215 and 217 may be scattered or focused by the lens part 260 and then emitted. Therefore, by modifying the shape of the lens part 260, it is possible to enhance the orientation angle and light emitting characteristics of the light emitting device 200.
[0060]FIG. 8 is a cross-sectional view of a light emitting device 300 according to a seventh embodiment, and FIG. 9 is a cross-sectional view of a light emitting device 300 according to an eighth embodiment. FIGS. 8 and 9 exemplarily show that the current embodiments are applied to chip on board (COB) type light emitting devices in which light emitting diodes 340 and 350 are mounted in a chip shape on a substrate 310.
[0061]As shown in FIGS. 8 and 9, the light emitting device 300 includes the substrate 310, a plurality of mounting parts 315 and 317 providing inclination surfaces for mounting the plurality of light emitting diodes 340 and 350, and a resin part 360 sealing the light emitting diodes 340 and 350, and the light emitting diodes 340 and 350 may be electrically connected to the substrate 310 through a wire (not shown).
[0062]The substrate 310 may use various substrates, such as a single-layer printed circuit board (PCB), a multi-layer PCB, an FPCB, a ceramic substrate, a metal substrate, etc. A lead frame or an electrode layer for supplying power may be patterned on the substrate 310, and a reflective layer may be formed. Also, a cavity for mounting the light emitting diodes 340 and 350 may be formed.
[0063]The light emitting diodes 340 and 350 may be arranged in plurality on the substrate in a row direction and/or a column direction, and are electrically connected to the substrate 310. The light emitting diodes 340 and 350 may be fixed on the substrate 310 by using a wire bonding, a flip chip bonding, a die bonding, or the like. The light emitting diodes 340 and 350 may be at least one of a red light emitting diode emitting red light, a green light emitting diode emitting green light, and a blue light emitting diode emitting blue light, and are not limited thereto. In this embodiment, since the light emitting diodes 340 and 350 are two or more, it is also possible to apply the light emitting diodes 340 and 350 each emitting a different color light.
[0064]The mounting parts 315 and 317 may be formed on the substrate 310 and provide inclination surfaces for mounting the light emitting diodes 340 and 350. As the light emitting diodes 340 and 350 are mounted on the mounting parts 315 and 317, the light emitting diodes 340 and 350 are fixed with slopes according to slopes of the mounting parts 315 and 317. Therefore, the orientation angle of the light emitting device 300 varies with the slopes of the mounting parts 315 and 317. The mounting parts 315 and 317 may be formed by processing the substrate 310 to allow mounting regions of the substrate 310 to be protruded with inclination surfaces, or by attaching a protruded and inclined structure capable of mounting the light emitting diodes 340 and 350 on the substrate 310.
[0065]The mounting parts 315 and 317 may be formed by two or more mounting parts according to the number of light emitting diodes which are being mounted, and may be arranged in various configurations in consideration of the orientation angle and heat radiation characteristic. The current embodiment exemplarily shows that the first light emitting diode 340 is mounted on the inclination surface of the first mounting part 315 and the second light emitting diode 350 is mounted on the inclination surface of the second mounting part 317.
[0066]In the case of the light emitting device 300 according to the seventh embodiment shown in FIG. 8, the inclination surface of the first mounting part 315 may be formed in the left (L) direction, and the inclination surface of the second mounting part 317 may be formed in the right (R) direction. Therefore, when the light emitting diodes 340 and 350 are mounted on the mounting parts 315 and 317, respectively, the direction of light emitted from the first light emitting diode 340 is inclined in the left (L) direction with respect to a center line, and the direction of light emitted from the second light emitting diode 350 is inclined in the right (R) direction with respect to the center line. Herein, as the slopes α and β of the mounting parts 315 and 317 increase, the orientation angles of the lights emitted from the first and second light emitting diodes 340 and 350 are directed toward the left (L) or right (R) direction from the center line. Therefore, by adjusting the slopes α and β of the mounting parts 315 and 317, it is possible to adjust the orientation angle at a wider angle.
[0067]In the case of the light emitting device 300 according to the eighth embodiment shown in FIG. 9, an inclination surface of the first mounting part 315 and an inclination surface of the second mounting part 317 are formed facing each other. Therefore, when the light emitting diodes 340 and 350 are mounted on the mounting parts, respectively, the light emitted from the first light emitting diode 340 and the light emitted from the second light emitting diode 350 are directed toward a center line and focused. As the slopes of the mounting parts 315 and 317 increase, the lights emitted from the light emitting diodes 340 and 350 are oriented toward the center line. Therefore, by adjusting the slopes of the mounting parts 315 and 317, the orientation angle ranges can be adjusted.
[0068]Meanwhile, the light emitting diodes 340 and 350 mounted on the mounting parts 315 and 317 may be sealed by a resin part 360. The resin part 360 may be formed in a semispherical shape or a convex lens shape using a transparent resin such as epoxy, and the material and shape of the resin part 360 may be modified according to the layout of the light emitting device 300. Also, a fluorescent material changing the light emitting characteristic may be added to at least a region of the resin part 360.
[0069]As exemplarily described in the seventh embodiment and the eighth embodiment, in the COB type light emitting devices 300, the plural mounting parts 315 and 317 having a slope are formed on the substrate 310 such that the light emitting diodes 340 and 350 are mounted with a slope with respect to a horizontal surface of the light emitting device 300. Therefore, the light irradiation direction and the orientation angle can be adjusted without a large change in the structure of the light emitting device 300.
[0070]FIG. 10 is a schematic view showing irradiation state of light emitted from a light emitting diode according to a related art, and FIGS. 11 through 13 are schematic views showing irradiation states of lights emitted from light emitting diodes according to the embodiments.
[0071]As shown in FIG. 10, a light emitting diode 140 mounted in a light emitting device has an orientation angle of about 120°, and typically may have an orientation angle of about 110°-130°. Therefore, in the case where the light emitting diode 140 is mounted in a direction parallel to a horizontal surface, the irradiation direction of light is concentrated in a vertical direction and the orientation angle may be set to 110°-130°. FIG. 10 exemplarily shows that the light is irradiated at an orientation angle of 120°.
[0072]FIG. 11 is a schematic view showing irradiation state of light when two light emitting diodes 140 and 150 have inclination directions (L and R) opposite to each other and have the same slope (i.e., α=β) according to the embodiment. When the light emitting diodes 140 and 150 are mounted with slopes of α° and β° with respect to a horizontal surface, the irradiation direction of light is moved by α° and β° from a center line, respectively.
[0073]The first mounting part 115 is disposed at the left (L) and has a slope of α° in the left direction. Accordingly, the orientation angle of the first light emitting diode 140 mounted on the first mounting part 115 is inclined by α° toward the left direction (L) from the center line. For example, when the orientation angle of the first light emitting diode 140 is 120°, the orientation angle is inclined by 60°+α° toward the left direction from the center line.
[0074]The second mounting part 117 is disposed at the right (R) and has a slope of β° in the right direction. Accordingly, the orientation angle of the second light emitting diode 150 mounted on the second mounting part 117 is inclined by β° toward the right direction (R) from the center line. For example, when the orientation angle of the second light emitting diode 150 is 120°, the orientation angle is inclined by 60°+β° toward the right direction from the center line.
[0075]Therefore, in the case of the light emitting device including the first light emitting diode 140 and the second light emitting diode 150, the orientation angle may be expanded by α° in the left direction (L) and by β° in the right (R) direction.
[0076]FIG. 12 is a schematic view showing irradiation state of light when two light emitting diodes 140 and 150 have inclination directions (L and R) opposite to each other, respectively and a slope α of a first mounting part 115 is greater than a slope β of a second mounting part 117 (i.e., α>β) according to the embodiment.
[0077]The first mounting part 115 is disposed at the left (L) and an inclination surface of the first mounting part 115 has the slope of α° in the left direction. Accordingly, the orientation angle of the first light emitting diode 140 mounted on the first mounting part 115 is inclined by α° toward the left direction (L) from the center line. For example, when the orientation angle of the first light emitting diode 140 is 120°, the orientation angle is inclined by 60°+α° toward the left direction from the center line.
[0078]The second mounting part 117 is disposed at the right (R) and an inclination surface of the second mounting part 117 has the slope of β in the right direction. Accordingly, the orientation angle of the second light emitting diode 150 mounted on the second mounting part 117 is inclined by β° toward the right direction (R) from the center line. For example, when the orientation angle of the second light emitting diode 150 is 120°, the orientation angle is inclined by 60°+β° toward the right direction from the center line.
[0079]Then, since the slope α of the first mounting part 115 is set greater than the slope β of the second mounting part 117 (i.e., α>β), the orientation angle of the light emitting device including the first light emitting diode 140 and the second light emitting diode 150 is inclined toward the left direction as a whole. That is, by mounting two light emitting diodes 140 and 150 on the mounting parts 115 and 117 having different slopes, the orientation angle of the light emitting device can be adjusted in a desired direction.
[0080]FIG. 13 is a schematic view showing irradiation state of light when two light emitting diodes 140 and 150 are mounted in a first mounting part 115 and a second mounting part 117, inclination surfaces of which are formed facing each other.
[0081]The first mounting part 115 is disposed at the left (L) and an inclination surface of the first mounting part 115 is formed with the slope of α° in the right (R) direction. Accordingly, the orientation angle of the first light emitting diode 140 mounted on the first mounting part 115 is inclined by α° toward the right direction (R) from the center line. Therefore, when the orientation angle of the first light emitting diode 140 is 120°, the orientation angle is inclined by 60°−α° toward the right direction from the center line.
[0082]The second mounting part 117 is disposed at the right (R) and an inclination surface of the second mounting part 117 is formed with the slope of β° in the left (L) direction. Accordingly, the orientation angle of the second light emitting diode 150 mounted on the second mounting part 117 is inclined by β° toward the left direction (L) from the center line. Therefore, when the orientation angle of the second light emitting diode 150 is 120°, the orientation angle is inclined by 60°−β° toward the left direction from the center line.
[0083]Accordingly, in the case of the light emitting device including the first light emitting diode 140 and the second light emitting diode 150, the orientation angle may be reduced by α° in the left direction (L) and by β° in the right (R) direction.
[0084]As described above, the embodiments can expand or reduce the orientation angle of the light emitting devices and adjust the orientation angle at a desired direction by adjusting the inclination directions and slopes of the mounting parts 115 and 117 on which the light emitting diodes 140 and 150 are mounted.
[0085]FIG. 14 is a schematic view of a light unit 500 according to a first embodiment, and exemplarily shows an edge type backlight unit.
[0086]As shown in FIG. 14, the light unit 500 includes a light guide panel 510 guiding light, and a light source 520 supplying the light guide panel 51