IPC分类号：
F21K99/00 | H01L33/62 | H01L33/64 | H05K1/02 | H05K1/03 | H05K1/18 | H05K3/00 | H05K3/46 | H01L21/00
国民经济行业分类号：
C3545 | C3871 | C3976
当前申请(专利权)人：
MITSUBISHI GAS CHEMICAL COMPANY, INC.
原始申请(专利权)人：
OHYA, KAZUYUKI | SAYAMA, NORIO | OHWADA, HISASHI
当前申请(专利权)人地址：
5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-0005, JAPAN
发明人：
OHYA, KAZUYUKI | SAYAMA, NORIO | OHWADA, HISASHI
摘要：
An LED lamp manufacturing process comprising manufacturing a multi-layer printed wiring board having a large number of LED lamp portions, each comprising a depressed portion whose side wall reflects light and has a mounted LED chip sealing resin container function and whose inner bottom has an LED chip mounting pattern, and a terminal pattern which is made conductive with the LED chip mounting pattern and formed on the outer under surface or outer side surface of the depressed portion, mounting predetermined LED chips on the LED chip mounting patterns, sealing the depressed portions with a resin and cutting the board into individual LED lamps, wherein the process comprises: a) preparing a plated through hole printed wiring board (P) having LED chip mounting patterns and terminal patterns formed thereon; b) preparing a through hole formed board (H) having through holes which correspond to the depressed portions and if necessary, have a treated wall to increase reflectance; and c) aligning the through hole formed board (H) with the above plated through hole printed wiring board (P) and bonding them together. According to the present invention, an LED lamp having a greatly increased LED chip mounting space can be manufactured and its assembly work can be simplified. Therefore, the manufacturing process of the present invention has a great industrial value.
技术功效语段：
[0007] Although an LED is a light emitting device having high efficiency, an LED lamp having the above characteristic features has a high heating density and value, generates a large quantity of heat and therefore cannot be used in conjunction with a conventional resin substrate.
权利要求：
What is claimed is:
1. An LED lamp manufacturing process comprising manufacturing a multi-layer printed wiring board having a large number of LED lamp portions, each comprising a depressed portion whose side wall reflects light and has a mounted LED chip sealing resin container function and whose inner bottom has an LED chip mounting pattern, and a terminal pattern which is made conductive with the LED chip mounting pattern and formed on the outer under surface or outer side surface of the depressed portion, mounting predetermined LED chips on the LED chip mounting patterns, sealing the depressed portions with a resin and cutting the board into individual LED lamps, wherein the process comprises: a) preparing a plated through hole printed wiring board (P) having LED chip mounting patterns and terminal patterns formed thereon; b) preparing a through hole formed board (H) having through holes which correspond to the depressed portions and if necessary, have a treated wall to increase reflectance; and c) aligning the through hole formed board (H) with the above plated through hole printed wiring board (P) and bonding them together.
2. The LED lamp manufacturing process according to claim 1, wherein the plated through hole printed wiring board (P) has a heat conductivity of 30 W(mk).sup.-1 or more.
3. The LED lamp manufacturing process according to claim 1, wherein the plated through hole printed wring board (P) is formed from a double-side copper-clad resin-impregnated composite ceramic board.
4. The LED lamp manufacturing process according to claim 1, wherein bonding is carried out with a thermoplastic polyimide resin.
5. The LED lamp manufacturing process according to claim 1, wherein LED chips are mounted on each LED mounting pattern of the plated through hole printed wiring board (P), the through hole formed board (H) is aligned with and bonded to the plated through hole printed wiring board (P), the depressed portions are sealed with a resin, and the assembly is cut.
6. The LED lamp manufacturing process according to claim 1, wherein the short diameter of the through holes of the through hole formed board (H) is 0.8 mm or less.
7. The LED lamp manufacturing process according to claim 5, wherein some or all of the location marks of the LED chip mounting patterns formed on the plated through hole printed wiring board (P) overlap with the bonding portions of the through hole formed board (H).