摘要：
A composite coin, coin black, medal or token structure provides an inner stack, an outer ring surrounding the inner stack, and a separator, an authentication method and method of manufacture for the same. The inner stack comprises one or more inserts stacked on top of each other. The separator is disposed between the outer ring and the inner stack separating the outer ring from the inner stack and separating the plurality of inserts from each other.
权利要求：
1. A composite structure comprising:
an inner stack comprising a plurality of inserts stacked on top of each other and at
least one of the plurality of inserts comprises a metallic material;
an outer ring annularly surrounding the inner stack, the outer ring comprising a
metallic material; and
a separator disposed between the outer ring and the inner stack separating the
outer ring from the inner stack and separating the plurality of inserts from each other for
retaining the inner stack within the outer ring, the separator comprising at least one recess,
wherein the separator comprises a separator wall disposed between the outer ring and the
inner stack, and defining an interior area housing the inner stack, the separator wall having
an outer face and an inner face, and wherein the inner face of the separator wall comprises
at least one recess.
2. The composite structure of claim 1, wherein the separator comprises at least one
divider disposed within the interior area.
3. The composite structure of claim 2, wherein the at least one divider separates the
plurality of inserts from each other.
4. The composite structure of any one of claims 1 to 3, wherein the separator
comprises a polymeric, metallic, semi-metallic, glass, ceramic, or composite material.
5. The composite structure of any one of claims 1 to 4, wherein the separator
comprises a dielectric material.
6. The composite structure of any one of claims 1 to 4, wherein the separator
comprises a conductive material.
7. The composite structure of any one of claims 1 to 4, wherein the separator
comprises a semi-conductive material.
8. The composite structure of any one of claims 1 to 7, wherein an outer
circumferential surface of each of the plurality of inserts comprises at least one recess.
9. The composite structure of any one of claims 1 to 7, wherein an inner circumferential
surface of the outer ring comprises at least one recess.
10. The composite structure of any one of claims 1 to 7, wherein the plurality of inserts
and the separator are locked together by at least one recess formed in an outer
circumferential surface of the plurality of inserts.
11. The composite structure of any one of claims 1 to 7, wherein the separator and the
outer ring are locked together by at least one recess formed in an outer circumferential
surface of separator.
12. The composite structure of any one of claims 1 to 7, wherein the separator and the
outer ring are locked together by at least one recess formed in an inner circumferential
surface of the outer ring.
13. The composite structure of claim 1, wherein the separator comprises at least one
divider comprising at least one aperture and separating the plurality of inserts and defining
a void between the plurality of inserts.
14. The composite structure of claim 13, wherein the at least one divider comprises at
least one protrusion extending to at least one outer surface of the inner stack.
15. The composite structure of any one of claims 1 to 14, wherein the separator is
marked with at least one figure or symbol.
16. The composite structure of any one of claims 1 to 15, wherein at least one insert is
marked with at least one figure or symbol.
17. The composite structure of any one of claims 1 to 16, wherein the separator
comprises particles in micro or nano scale.
18. The composite structure of any one of claims 1 to 17, wherein the separator is
transparent.
19. The composite structure of any one of claims 1 to 17, wherein the separator is
translucent or opaque.
20. The composite structure of any one of claims 1 to 17, wherein the separator is
colorless.
21. The composite structure of any one of claims 1 to 17, wherein the separator is
colored.
22. The composite structure of any one of claims 1 to 21, wherein the composite
structure is a coin.
23. The composite structure of any one of claims 1 to 21, wherein the composite
structure is a coin blank.
24. The composite structure of any one of claims 1 to 21, wherein the composite
structure is a medal.
25. The composite structure of any one of claims 1 to 21, wherein the composite
structure is a token.
26. The composite structure of any one of claims 1 to 21, wherein the composite
structure is a chip.
27. The composite structure of any one of claims 1 to 21, wherein the composite
structure is a gaming chip.
28. The composite structure of any one of claims 1 to 21, wherein the composite
structure is a medallion.
29. The composite structure of any one of claims 1 to 21, wherein the separator varies
in cross-sectional area.
30. The composite structure of any one of claims 13, 14, and 15 to 29 when dependent
on claim 13 or 14, wherein the separator comprises a major axis and at least one minor
axis and defines the aperture as a circle.
31. The composite structure of any one of claims 13, 14, and 15 to 29 when dependent
on claim 13 or 14, wherein the separator comprises a major axis and at least one minor
axis and defines the aperture as non-circular.
32. A method for authenticating a composite structure, the composite structure
comprising an inner stack of inserts, an outer ring and a separator comprising at least one
recess and disposed between the outer ring and the inner stack separating the outer ring
from the inner stack for retaining the inner stack within the outer ring, wherein the separator
comprises a separator wall disposed between the outer ring and the inner stack, and
defining an interior area housing the inner stack, the separator wall having an outer face
and an inner face, and wherein the inner face of the separator wall comprises at least one
recess, wherein the method comprises:
setting at least one pre-determined reference standard frequency-dependent
capacitance or conductivity value range for at least one of:
a first and a second stacked insert;
a first insert and the outer ring; and
a second insert and the outer ring;
measuring at least one measured frequency-dependent capacitance or conductivity
value between at least one of:
the first and the second stacked insert;
the first insert and the outer ring; and
the second insert and the outer ring;
comparing the at least one measured frequency-dependent capacitance or
conductivity value to the corresponding pre-determined reference standard range; and
authenticating the composite structure if the measured frequency-dependent
capacitance or conductivity values falls within the pre-determined reference standard
range.
33. A method for manufacturing a composite structure comprising:
stacking a plurality of inserts on top of each other to form an inner stack, wherein at
least one of the plurality of inserts comprises a metallic material;
disposing a separator between the plurality of inserts for separating the plurality of
inserts from each other and annularly surrounding the inner stack and separator with an
outer ring, the separator comprising at least one recess, wherein the outer ring comprises
a metallic material, to form a pre-assembly, the pre-assembly having opposite first and
second sides, wherein the separator comprises a separator wall disposed between the
outer ring and the inner stack, and defining an interior area housing the inner stack, the
separator wall having an outer face and an inner face, and wherein the inner face of the
separator wall comprises at least one recess;
arranging the pre-assembly on a die, the die having a first engraving for impressing
upon the first side of the pre-assembly; and
applying pressure to the pre-assembly with a press, the press having a second die
with a second engraving for simultaneously striking and stamping the pre-assembly and
producing the composite structure.