发明人：
BUDIMAN SALAM | LU, CHEE WAI ALBERT | LOK, BOON KENG | WAI, LAI LAI
权利要求：
CLAIMS
What is claimed is:
1. A light emitting device with integrated electrical interconnection comprising:
a first laminate having
a continuous coil of a first flexible substrate;
a transparent conductor printed directly onto the first flexible substrate;
a light emitting material printed directly onto the transparent conductor;
a dielectric layer printed directly onto the light emitting material; and
a conductive adhesive deposited directly onto the dielectric layer; and
a second laminate having
a continuous coil of a second flexible substrate,
wherein the first laminate and the second laminate are electrically coupled via
an electrode layer to provide interconnection for the light emitting device.
2. The light emitting device in accordance with Claim 1, wherein
the second laminate has a dimension larger than that of the first laminate.
3. The light emitting device in accordance with Claim 1, wherein
the conductive adhesive is a silver particle filled polymer.
4. A light emitting device with integrated electrical interconnection
comprising:
a first laminate having
a continuous coil of a first flexible substrate;
a transparent conductor printed directly onto the first flexible substrate;
a light emitting material printed directly onto the transparent conductor;
a dielectric layer printed directly onto the light emitting material; and
a conductive adhesive deposited directly onto the dielectric layer; and a second laminate having
a continuous coil of laminate same as the first laminate
wherein the first laminate and the second laminate are electrically coupled via
an electrode layer to provide interconnection for the light emitting device,
5, The light emitting device in accordance with Claim 4, wherein the second laminate has a dimension larger than that of the first laminate.
6, The light emitting device in accordance with Claim 4, wherein
the conductive adhesive is a silver particle filled polymer.
7, A method for manufacturing a light emitting device with integrated electrical interconnection comprising the steps of:
forming a first laminate, comprising the steps of,
providing a continuous coil of a first flexible substrate,
printing a transparent conductor directly onto the first flexible substrate;
printing a light emitting material directly onto the transparent conductor;
printing a dielectric layer directly onto the light emitting material; and
depositing a conductive adhesive directly onto the dielectric layer;
forming a second laminate, comprising the steps of,
providing a continuous coil of a second flexible substrate and/or a continuous coil of laminate same as the first laminate;
electrically coupling the first laminate and the second laminate via an electrode layer to provide interconnection for the light emitting device.