摘要：
In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
权利要求：
What is claimed is:
1. A method for making an illumination device, comprising:
providing a light emitter over a substrate comprising a substrate bond pad, the light emitter comprising a light emitter bond pad;
depositing an electrical interconnect over the light emitter and in contact with the light emitter bond pad and the substrate bond pad.
2. The method of Claim 1, wherein depositing the electrical interconnect comprises 3D printing the electrical interconnect.
3. The method of Claim 1, further comprising depositing a dielectric material over the light emitter before depositing the electrical interconnect.
4. The method of Claim 1, wherein depositing the dielectric material comprises 3D print the dielectric material.
5. The method of Claim 1, wherein depositing the electrical interconnect comprises depositing a metal.
6. The method of Claim 1, wherein the light emitter is a LED chip.
7. The method of Claim 1, wherein a maximum height of the electrical interconnect above the light emitter is 50 pm or less.
8. The method of Claim 1, further comprising coupling a light pipe to the light
emitter, wherein a light input surface of the light pipe faces an exposed surface of the light
emitter.
9. The method of Claim 1, further comprising coupling a reflector to the light emitter, wherein a light input surface of the reflector faces an exposed surface of the light emitter.
10. The method of Claim 1, wherein providing the light emitter comprises attaching the light emitter on an electrical contact on a surface of the substrate.
11. The method of Claim 1, wherein, after depositing, the electrical interconnect conformally follows contours of the light emitter.
12. The method of Claim 11, wherein the light emitter defines a step over the substrate, wherein the electrical interconnect follows contours of the step after depositing.
13. The method of Claim 1, wherein a cross-sectional shape of the electrical interconnect, as viewed in a plane traverse to an elongate axis of the electrical interconnect, has a width larger than a height of the cross-sectional shape.
14. The method of Claim 13, wherein the cross-sectional shape is rectangular.
15. The method of Claim 1, wherein the substrate is a printed circuit board.
16. The method of Claim 1, wherein the light emitter further comprises another light emitter bond pad.
17. The method of Claim 16, further comprising depositing another electrical interconnect over the light emitter and in contact with the other light emitter bond pad and another substrate bond pad.
18. The method of Claim 8, further comprising:
providing a light modulating device configured to receive light from the light pipe; and
providing a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the light modulating device.
19. The method of Claim 18, further comprising: providing a plurality of the light pipes, each light pipe configured to transmit light to the light modulating device.
20. The method of Claim 9, further comprising:
providing a light modulating device configured to receive light from the light pipe; and
providing a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the light modulating device.
21. The method of Claim 20, further comprising: providing a plurality of the reflectors, each reflector configured to direct light to the light modulating device.
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