Heat exchanger

公开(公告)号:
GB201609847D0
公开(公告)日:
2016-07-20
申请号:
GB2016009847
申请日:
2016-06-06
授权日:
-
受理局:
英国
专利类型:
发明申请
简单法律状态:
有效
法律状态/事件:
授权 | 权利转移
IPC分类号:
-
战略新兴产业分类:
-
国民经济行业分类号:
-
当前申请(专利权)人:
KEW TECHNOLOGY LIMITED
原始申请(专利权)人:
ENERGY TECHNOLOGIES INSTITUTE LLP | KAMALDEEP KALSI
当前申请(专利权)人地址:
38-39 Albert Road, Tamworth, B79 7JS, United Kingdom
工商统一社会信用代码:
-
工商登记状态:
-
工商注册地址:
-
工商成立日期:
2016
工商企业类型:
-
发明人:
-
代理机构:
-
代理人:
-
摘要:
A manifold 2 for a parallel flow heat exchanger (3, fig 1) comprises a first plurality of channels 5a each having an opening facing a first direction and an opening facing a second direction different from the first; a second plurality of channels 5b interleaved with the first channels and having an opening facing a third direction and an opening facing the first direction. The third direction is different from the other directions. The manifold may be 3D printed Silicon Carbide material and operate between 1070 and 1350 Celsius. The manifold may comprise a third plurality of channels and a fourth plurality of channels having an opening facing a fourth and fifth direction respectively and both have an opening facing the first direction. The fourth and fifth directions is different from the other directions. Two manifolds may be connected to opposite ends of the heat exchanger, which may comprise of a plurality of connected stacked and aligned heat exchange blocks. The heat exchanger may be housed in a refractory lined steel housing (7, fig 7). Parallel flow is intended to embrace fluids that flow parallel or anti parallel with each other (i.e. co-current (same direction) and counter-current (opposite directions)).
技术问题语段:
-
技术功效语段:
-
权利要求:
Claims 1. A manifold for a parallel flow heat exchanger, the manifold comprising: a first plurality of channels each having an opening facing a first direction and an opening facing a second direction different from the first direction; and a second plurality of channels interleaved with the first plurality of channels, the second plurality of channels having an opening facing a third direction and an opening facing the first direction, wherein the third direction is different from the first direction and the second direction. 2. A manifold of claim 1, wherein the manifold is adapted to operate at a temperature between 1,070 °C and 1350°C. 3. A manifold of any preceding claim wherein the manifold is Silicon Carbide or a Silicon Carbide derivative material. 4. A manifold of any preceding claim further comprising: a third plurality of channels having an opening facing a fourth direction and an opening facing the first direction, wherein the fourth direction is different from the first direction, the second direction, and the third direction. 5. A manifold of claim 4, wherein a predetermined number of interleaved channels from each of the first and second set of channels is disposed between consecutive channels from the third set of channels. 6. A manifold of claim 6, wherein the predetermined number is greater than one. 7. A manifold of any of claims 4 to 6, further comprising: a fourth plurality of channels having an opening facing a fifth direction and an opening facing the first direction, wherein the fifth direction is different from the first direction, the second direction, the third direction, and the fourth direction. 8. A method of manufacturing the manifold of any of claims 1 to 7, comprising 3D printing said manifold. 9. A heat exchanger comprising two manifolds connected to opposed sides of a heat exchange stack, wherein: each manifold is a manifold of any of claims I to 7; and the heat exchange stack comprises at least one heat exchange block, having a plurality of channels therethrough, the channels of the heat exchange block aligning with the channels of each manifold to form a series of gas paths encompassing both manifolds and the heat exchange stack. 10. A heat exchanger of claim 9, wherein each heat exchange block includes an inset area adapted to receive a gasket, said inset area being disposed on a surface of the block and surrounding the channels on the surface of the block. 11. A heat exchanger of claim 9, wherein a first fluid path comprises the first plurality of channels in one manifold and the first plurality of channels in the other manifold and a second fluid path comprises the second plurality of channels in one manifold and the second plurality of channels in the other manifold, the heat exchanger further comprising: a first connector adapted to connect the first fluid path to a first fluid source; and a second connector adapted to connect the second fluid path to a second fluid source. 12. A heat exchanger of claim 11, further comprising a third connector to connect the first fluid path to the second fluid source at an end of the first fluid path opposed to the first connector. 13. A heat exchanger of claim 11 or 12, wherein the first and second connectors are attached to the same manifold. 14. A heat exchanger of claim 11 or 12, wherein the first and second connectors are attached to the different manifolds. 15. A heat exchanger comprising means to receive multiple fluid inputs and cause them to discreetly flow against one another in a parallel manner, and means to distribute said multiple fluids on exit from said heat exchanger. 16. A manifold as hereinbefore described or as shown in the accompanying figures. 17. A heat exchanger as hereinbefore described or as shown in the accompanying figures. AMENDMENTS TO CLAIMS HAVE BEEN FILED AS FOLLOWS Claims 1. A manifold for a parallel flow heat exchanger, the manifold comprising: a first plurality of channels each having an opening facing a first direction and an opening facing a second direction different from the first direction, wherein each of the first plurality of channels has a curvature between the opening facing the first direction and the opening facing the second direction and there is no point along a heat transfer surface of the channel that is at right angles to a direction of fluid flow; and a second plurality of channels interleaved with the first plurality of channels, each of the second plurality of channels having an opening facing a third direction and an opening facing the first direction, wherein the third direction is different from the first direction and the second direction, and wherein each of the second plurality of channels has a curvature between the opening facing the third direction and the opening facing the first direction and there is no point along a heat transfer surface of the channel that is at right angles to a direction of the flow of fluid. 2. A manifold of claim 1, wherein the manifold is adapted to operate at a temperature between 1070°C and 1350°C. 3. A manifold of any preceding claim wherein the manifold is Silicon Carbide or a Silicon Carbide derivative material. 4. A manifold of any preceding claim further comprising: a third plurality of channels having an opening facing a fourth direction and an opening facing the first direction, wherein the fourth direction is different from the first direction, the second direction, and the third direction. 5. A manifold of claim 4, wherein a predetermined number of interleaved channels from each of the first and second set of channels is disposed between consecutive channels from the third set of channels. 6. A manifold of claim 6, wherein the predetermined number is greater than one. 7. A manifold of any of claims 4 to 6, further comprising: a fourth plurality of channels having an opening facing a fifth direction and an opening facing the first direction, wherein the fifth direction is different from the first direction, the second direction, the third direction, and the fourth direction. 8. A manifold of any preceding claim, wherein said manifold is suitable for an Advanced Thermal Treatment parallel flow heat exchanger. 9. A method of manufacturing the manifold of any of claims 1 to 8, comprising 3D printing said manifold. 10. A heat exchanger comprising two manifolds connected to opposed sides of a heat exchange stack, wherein: each manifold is a manifold of any of claims 1 to 8; and the heat exchange stack comprises at least one heat exchange block, having a plurality of channels therethrough, the channels of the heat exchange block aligning with the channels of each manifold to form a series of gas paths encompassing both manifolds and the heat exchange stack. 11. A heat exchanger of claim 10, wherein each heat exchange block includes an inset area adapted to receive a gasket, said inset area being disposed on a surface of the block and surrounding the channels on the surface of the block. 12. A heat exchanger of claim 10, wherein a first fluid path comprises the first plurality of channels in one manifold and the first plurality of channels in the other manifold and a second fluid path comprises the second plurality of channels in one manifold and the second plurality of channels in the other manifold, the heat exchanger further comprising: a first connector adapted to connect the first fluid path to a first fluid source; and a second connector adapted to connect the second fluid path to a second fluid source. 13. A heat exchanger of claim 12, further comprising a third connector to connect the first fluid path to the second fluid source at an end of the first fluid path opposed to the first connector. 14. A heat exchanger of claim 12 or 13, wherein the first and second connectors are attached to the same manifold. 15. A heat exchanger of claim 12 or 13, wherein the first and second connectors are attached to the different manifolds.
技术领域:
-
背景技术:
-
发明内容:
-
具体实施方式:
-
返回