当前申请(专利权)人地址：
12F.- 6,57 Section 1, Chongcing S. Road, Jhongjheng District, Taipei City, 10045, CHINESE CHINESE TAIWAN
摘要：
A method for manufacturing an LED circuit board with bowl like reflective cups12 includes the steps of combing a glass fiber layer 20 and a copper foil layer 25 to form a combining layer and attaching it to an upper surface of a copper substrate 10; drilling a plurality of penetrating holes 11 through the combining layer and the copper substrate; etching the copper foil; drilling the combining layer to form a plurality of cups; sandblasting; electroplating gold 30 to the copper foil layer of the combining layer for increasing electric conduction and heat dissipation; printing an insulating ink mask layer (or a paint) 40 on the upper surface of the gold layer; electroplating a plurality of metal joints 50 on the ink layer portions as electric joints; and removing parts of the insulating ink layer so as to expose the gold layer and baking the structure.
权利要求：
WHAT IS CLAIMED IS: 1. A method for manufacturing LED circuit board with bowl like cups therein, comprising: getting a copper substrate; combing a glass fiber layer and a copper foil layer to an upper surface of the copper substrate to form as a first combining layer; the copper foil layr being glued to the glass fiber layer; the glass fiber layer being as an insulating layer and being gluing to the copper substrate; drilling a plurality of penetrating holes on the combining layer; etching some parts of copper foil; and the copper foil not etched being used as conductive circuit and for dissipating heat from LEDs; drilling the first combining layer by CNC so as to form a plurality of cups on the upper surface of the first combining layer for installing LED dice; the cups do not penetrate through the first combining layer; sandblasting the upper surface of the first combining layer for coarsening and flattening the upper surface of the first combining layer; plating gold to the upper surface of the copper foil layer of the first combining layer for increasing electric conduction and heat dissipation; the structure combining the first combining layer and the gold being as a second combining layer; cleaning dirt or acid material on a surface of the first combining layer; printing an ink layer (or a paint) on the upper surface of the second combining layer as a third combining layer; radiating some part of ink portions so that these parts of ink portions being attached to the copper foil; plating a plurality of metal joints on the radiated ink portions as electric joints; remove parts of the insulating ink layer which is not radiated to expose the gold layer thereunder, and backing the third combining layer.
2. The method for manufacturing LED circuit board with bowl like cups therein as claimed in claim 1, wherein a knife with a flat bottom is used to form the cambered cups.
3. The method for manufacturing LED circuit board with bowl like cups therein as claimed in claim 1, wherein the step of etching some parts of copper foil, ii eluding the steps of: coating a layer of dry film to an upper surface of the first combining layer; performing etching process, i.e., developing the second combining layer to remove a part of dry film and then etching the copper foil not covered by the dry film; and removing other dry film in previous step and the copper foil not etched being used as conductive circuit and for dissipating heat from LEDs.
4. The method for manufacturing LED circuit board with bowl like cups therein as claimed in claim 3, wherein the step of radiating some parts of ink portions comprising the steps of: locating a negative (as an optical mask) above the ink layer; and using an exposure machine to emit ultraviolet ray to pass through the transparent portions of the negative; and then the ultraviolet ray passing through the negative will radiate portions of the ink layer under the transparent portions so that the radiated ink portions are completely attached to the copper foil; 5. The method for manufacturing LED circuit board with bowl like cups therein as claimed in claim 4, wherein the step of electroplating a plurality of metal joints comprising the steps of: removing the negative; plating a plurality of metal joints on the radiated ink portions as electric joints or for succeeding bonding operation.6. The method for manufacturing LED circuit board with bowl like cups therein as claimed in claim 5, wherein the step of removing parts of the insulating ink layer comprising the steps of: passing the insulating ink layer through developer and potassium carbonate is sprayed upon the insulating ink layer to remove part of the insulating ink layer which is not radiated by ultraviolet ray to expose the gold layer thereunder.7. The method for manufacturing LED circuit board with howl like cups therein as claimed in claim 1, wherein dividing the third combing layer into a plurality of small substrate.8. The method for manufacturing LED circuit board with bowl like cups therein as claimed in claim 1, wherein before electroplating gold to the upper surface of the copper foil, rnckel is plated upon the upper surface of the copper foil and then the gold is electroplated on the nickel.9. The method for manufacturing LED circuit board with bowl like cups as claimed in claim 7, wherein after dividing the third combing layer into a plurality of small substrate; further comprising the step of preparing LED die; adding silver glue to a cup of the small substrate by a dispensing robot dispenser; fixing the LED die in the cup by a die bonding machine; baking the small substrate; bonding wires to the metal joints so that the joints are conductive; performing current impact testing; filling epoxy to a periphery of the LED die; and baking the small substrate through eight hours under a temperature about degree C. 10. An LED circuit board with bowl like cups therein, comprising: a copper substrate; a glass fiber layer and a copper foil layer installed on the copper substrate so as to form as a first combining layer; the copper foil layer being glued to the glass fiber layer; and the glass fiber layer being as an insulating layer and being glued to the copper substrate; a plurality of penetrating holes being formed on the first combining layer; a plurality of non-penetrating cups being formed on the first combining layer for installing LED dice therein; the copper foil layer being etched to leave only some parts of the copper foil as conductive wires in the circuit board; a gold plating layer being formed on the copper foil layer for increasing heat conductivity and heat dissipation; and the combination of the first combining layer and the gold plating layer being a second combining layer; an insulating ink layer being plated on the upper surface of the second combining layer so as to form as a third combining layer; some parts of the insulating ink layer being etched to expose internal gold plating layer; and some parts of the insulating ink layer being plated with metal as metal joints; and a plurality of gold joints on the insulating ink layer which are ased as joints or used for bonding work.11. The LED circuit board with bowl like cups therein as claimed in claim 10, wherein a nickel layer is plated upon the upper surface of the copper foil and is under the gold layer.12. The LED circuit board with bowl like cups therein as claimed in claim 10, wherein in manufacturing process, a negative (of a photo) is placed upon the insulating ink layer; then overall structure is moved to be under an exposure unit for radiating with ultraviolet rays; the ultraviolet ray will pass through some transparent areas in the negative to the insulating ink layer under the negative so that the parts of the insulating ink layer radiated by ultraviolet rays are completely attached to the gold plating layer; then the insulating ink layer passes through developer and potassium carbonate is sprayed upon the insulating ink layer to remove part of the insulating ink layer which is not radiated by ultraviolet ray to expose the gold plating layer thereunder.13. A method of manufacturing an LED circuit board substantially as hereinbefore described with reference to the accompanying drawings.14. An LED circuit board manufactured by the method claimed in Claim 13.