当前申请(专利权)人地址：
Incorporated in USA - Illinois, 100 North Riverside Plaza, Chicago, Illinois 60606-2016, United States of America
摘要：
A system of interconnecting structures fabricated utilizing an additive manufacturing process is described. The system includes a first component comprising a first unit of an interconnection mechanism, and a second component comprising a second unit of an interconnection mechanism. The first component and first unit are integrally formed utilizing the additive manufacturing process as are the second component and the second unit. The first unit and the second unit are operable to engage one another to attach the first component to the second component.
权利要求：
CLAIMS
WHAT IS CLAIMED IS:
1. A system of interconnecting structures fabricated utilizing an additive manufacturing process, said system comprising: a first component comprising a first unit of an interconnection mechanism, said first component and said first unit integrally formed utilizing the additive manufacturing process; and a second component comprising a second unit of an interconnection mechanism, said second component and said second unit integrally formed utilizing the additive manufacturing process, said first unit and said second unit operable to engage one another to attach said first component to said second component.
2. A system according to Claim 1 wherein the additive manufacturing process is a selective laser sintering process.
3. A system according to Claim 1 wherein said first component and said second component comprise an aerospace structure.
4. A system according to Claim 1 wherein said first unit and said second unit are releaseably engageable with one another.
5. A system according to Claim 1 wherein said first component and said second component each comprise at least one panel, said first unit and said second unit integrally formed as a part of each respective said panel.
6. A system according to Claim 1 wherein: said first component comprises an outer surface and said first unit comprises at least one pair of opposing receiving pockets integrally formed on said outer surface of said first component; and said second component comprises a removable panel, said second unit extending therefrom and comprising at least one pair of opposing clip tabs integrally formed with said second component, said opposing clip tabs configured to engage respective said receiving pockets, to retain said removable panel in an engaged position with respect to said first component.
7. A system according to Claim 1 wherein: said first component comprises an interior surface comprising an indentation formed in said interior surface; and said second component comprises a removable panel, said second unit extending therefrom and comprising at least one clip tongue configured to depress slightly and slide along said interior surface and engage said indentation to retain said removable panel in an engaged position with respect to said first component.
8. A system according to Claim 1 wherein: said first component comprises an exterior surface comprising a raised detent formed thereon; and said second component comprises a removable panel, said second unit extending therefrom and comprising at least one clip tongue configured to widen and slide along said exterior surface and engage said detent, said clip tongue configured to engage said detent to retain said removable panel in an engaged position with respect to said first component.
9. A system according to Claim 1 wherein: said first unit comprises a receptacle; and said second unit comprises a member that is releasably engageable within said receptacle to attach said first component to said second component.
10. A method for direct manufacturing a plurality of interconnecting components, said method comprising: defining, for input into a direct manufacturing process, a configuration for a first component, the definition including parameters for at least one interconnection unit to be integrally formed with the first component; the at least one interconnection unit configured for interconnecting the first component to a second component; integrally forming the first component including the at least one interconnection unit utilizing the direct manufacturing process; defining, for input into the direct manufacturing process, a configuration for the second component, the definition including parameters for at least one receiving unit to be integrally formed with the second component; and integrally forming the second component including the at least one receiving unit utilizing the direct manufacturing process, where the at least one interconnection unit is configured to engage the at least one receiving unit to maintain a position of the first component with respect to the second component.
11. A method according to Claim 10 wherein integrally forming comprises utilizing a selective laser sintering process.