Large area arrayed light valves

公开(公告)号:
EP4237745A1
公开(公告)日:
2023-09-06
申请号:
EP2021887526
申请日:
2021-10-28
授权日:
-
受理局:
欧洲专利局
专利类型:
发明申请
简单法律状态:
审中
法律状态/事件:
公开
IPC分类号:
F21V8/00 | G02B27/00 | G02B30/00
战略新兴产业分类:
-
国民经济行业分类号:
C4350 | C3874 | C4090 | C3879
当前申请(专利权)人:
SEURAT TECHNOLOGIES, INC.
原始申请(专利权)人:
SEURAT TECHNOLOGIES, INC.
当前申请(专利权)人地址:
265 Ballardvale St.,Wilmington, MA 01887,US
工商统一社会信用代码:
-
工商登记状态:
-
工商注册地址:
-
工商成立日期:
2015-07-01
工商企业类型:
-
发明人:
LEARD, FRANCIS, L. | DEMUTH, JAMES, A. | BAYRAMIAN, ANDREW, J. | KISSINGER, DREW, W. | GILLESPIE, JOSEPH
代理机构:
BETTEN & RESCH
代理人:
-
摘要:
An additive manufacturing system includes at least two photoconductor plates attached to a substrate. Each photoconductor plate can include separate the Linear Electro layers and transparent conductive oxide layers.
技术问题语段:
The technical problem addressed in this patent is the need for large area light valves that can be used in high power laser systems, but are currently limited in size due to the size of the photoconductor crystals. The invention aims to provide a solution by creating a photoconductor composite that can be bonded to a supporting substrate, allowing for a larger clear aperture and higher energy laser systems. The invention also describes a method for manufacturing an array of these photoconductor composites for parallel manufacturing and recovery of waste energy.
技术功效语段:
The present patent is about a method for creating large area light valves for high power laser systems. The technical effect is that the invention allows for the use of larger photoconductors fixed to a substrate, which increases the size of the light valve. This is important because the size limitation of conventional photoconductors limits the size of the light valve to be about 30 mm x 30 mm. The invention also describes a method for manufacturing a large area light valve by singulating photoconductor blocks and using a switchyard approach for recovery and further usage of waste energy. Overall, the invention provides a way to create large area light valves that can improve the production rate of metal additive manufacturing.
权利要求:
CLAIMS 1. A light valve, comprising: a substrate; and at least two photoconductor plates attached to the substrate. 2. The light valve of claim 1, wherein the substrate is sapphire. 3. The light valve of claim 1, wherein the at least two photoconductor plates attached to the substrate are laterally positioned with respect to each other. 4. The light valve of claim 1, wherein the at least two photoconductor plates are attached to the substrate with a glass glue. 5. The light valve of claim 1, wherein the at least two photoconductor plates are thermal expansion matched to the substrate. 6. The light valve of claim 1, wherein the at least two photoconductor plates are each attached to secondary substrates that are each attached to the substrate. 7. The light valve of claim 1, wherein the at least two photoconductor plates include at least one of Bismuth Silicates, Bismuth Germanates, Cadmium Selenides, chalcogenide glasses, polycrystalline materials, or amorphous silicon. 8. The light valve of claim 1, wherein the at least two photoconductor plates include at least one of BSO, Bi12SiO20, Bi6SiO10, Bi3SiO5, Bismuth Germanates, BGO, Bi12GeO20, Bi6GeO10, Bi3GeO5, CdSe, Ge2Sb2Te5(GST), Sc0.2Sb2Te3, GeTe, Ag4In3Sb67Te26, Ge15Sb85, Sb, CdTe, AZO, ZnSe, ZnS, or Si. 9. The light valve of claim 1, wherein the at least two photoconductor plates form a NxM array on the substrate. 10. The light valve of claim 1, wherein the at least two photoconductor plates each have an included LEO and TCO layer. 11. An additive manufacturing system, comprising a laser light source to form a laser beam; a light valve supporting two-dimensional patterning of the light beam, the light valve including a substrate; and at least two photoconductor plates attached to the substrate. 12. The additive manufacturing system of claim 11, wherein the substrate is sapphire. 13. The additive manufacturing system of claim 11, wherein the at least two photoconductor plates attached to the substrate are laterally positioned with respect to each other. 14. The additive manufacturing system of claim 11, wherein the at least two photoconductor plates are attached to the substrate with a glass glue. 15. The additive manufacturing system of claim 11, wherein the at least two photoconductor plates are thermal expansion matched to the substrate. 16. The additive manufacturing system of claim 11, wherein the at least two photoconductor plates are each attached to secondary substrates that are each attached to the substrate. 17. The additive manufacturing system of claim 11, wherein the at least two photoconductor plates include at least one of Bismuth Silicates, Bismuth Germanates, Cadmium Selenides, chalcogenide glasses, polycrystalline materials, or amorphous silicon. 18. The additive manufacturing system of claim 11, wherein the at least two photoconductor plates include at least one of BSO, Bi12SiO20, Bi6SiO10, Bi3SiO5, Bismuth Germanates, BGO, Bi12GeO20, Bi6GeO10, Bi3GeO5, CdSe, Ge2Sb2Te5(GST), Sc0.2Sb2Te3, GeTe, Ag4In3Sb67Te26, Ge15Sb85, Sb, CdTe, AZO, ZnSe, ZnS, or Si. 19. The additive manufacturing system of claim 11, wherein the at least two photoconductor plates form a NxM array on the substrate. 20. The additive manufacturing system of claim 11, wherein the at least two photoconductor plates each have an included LEO and TCO layer.
技术领域:
-
背景技术:
-
发明内容:
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具体实施方式:
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