IPC分类号：
B33Y70/00 | B29C64/106 | B33Y10/00 | B33Y80/00 | B28B1/00 | C08K3/38 | D01F1/10 | B29C70/62
当前申请(专利权)人：
3M INNOVATIVE PROPERTIES COMPANY
原始申请(专利权)人：
3M INNOVATIVE PROPERTIES COMPANY
当前申请(专利权)人地址：
3M Center,Saint Paul, MN 55133-3427,US
发明人：
SCHÄDEL, ROBERT | UIBEL, KRISHNA | WILDHACK, STEFANIE
摘要：
The present disclosure relates to a filamentary structure manufactured during 3D printing by fused filament fabrication, the filamentary structure comprising a continuous strand comprising a thermoplastically workable material and filler particles, wherein the filler particles comprise hexagonal boron nitride particles comprising hexagonal boron nitride platelets. The present disclosure further relates to a 3D printable filament for manufacturing said filamentary structure, to a 3D printed component part formed from said filamentary structure, to a 3D printing method for making said 3D printed component part, and to the use of said component part.
技术问题语段：
The patent text discusses the demand for thermally conductive and electrically insulating polymer materials for various applications such as in electronic devices and electric vehicles. To increase the thermal conductivity, thermally conductive fillers such as alumina and boron nitride are used. However, the orientation of the fillers in the final component part can affect the thermal conductivity. Injection molding and 3D printing are two common methods for manufacturing these components, but each method has its limitations. The technical problem addressed in this patent is to create a polymer-boron nitride composition with high in-plane and through-plane thermal conductivity that can be economically produced.
技术功效语段：
The patent describes a method for 3D printing a thermally conductive component part directly into an electronic device. This component part is in closest connection to the electronic device for transferring the heat. Compared to injection molded parts, a gap filler material would be needed to fill the gap between the electronic device and the injection molded part. The method allows for the production of composite component parts filled with boron nitride and having high in-plane or through-plane thermal conductivity as required. It is cost-effective and flexible. The technical effect is the creation of a more efficient heat transfer mechanism that improves the thermal performance of thermally conductive component parts in electronic devices.
权利要求：
1. A filamentary structure manufactured during 3D printing by fused filament fabrication, the filamentary structure comprising a continuous strand comprising a thermoplastic workable material and filler particles, wherein the filler particles comprise hexagonal boron nitride particles comprising hexagonal boron nitride platelets, and wherein the ratio of the width of the continuous strand to the height of the continuous strand is either more than 2 or less than 1.
2. The filamentary structure of claim 1, wherein the boron nitride platelets have a mean aspect ratio of more than 7.
3. The filamentary structure of claim 1 or 2, wherein the mean particle size (d50) of the boron nitride platelets is from 5 to 100 µm.
4. The filamentary structure of any of claims 1 to 3, wherein the thermoplastically workable material is selected from the group consisting of thermoplastic materials, thermoplastically workable duroplastic materials, and mixtures thereof.
5. The filamentary structure of any of claims 1 to 4, wherein at least one part of the continuous strand comprises portions being oriented parallel to one another.
6. A 3D printable filament for manufacturing the filamentary structure of any of claims 1 to 5 during 3D printing, wherein the filament comprises a thermoplastically workable material and filler particles, wherein the filler particles comprise hexagonal boron nitride particles comprising hexagonal boron nitride platelets.
7. A 3D printed component part comprising at least one portion formed from the filamentary structure of any one of claims 1 to 5.
8. The component part of claim 7, wherein the at least one portion of the component part formed from the filamentary structure of any one of claims 1 to 5 has a texture index of at least 8, and wherein the ratio of the width of the continuous strand to the height of the continuous strand is more than 2.
9. The component part of claim 7, wherein the at least one portion of the component part formed from the filamentary structure of any one of claims 1 to 5 has a texture index of less than 1, and wherein the ratio of the width of the continuous strand to the height of the continuous strand in the filamentary structure is less than 1.
10. The component part according to any one of claims 7 to 9, wherein the at least one portion of the component part has a relative density of at least 60% of the theoretical density of the filamentary structure.
11. A 3D printing method for making the 3D printed component part of any one of claims 7 to 10, the method comprising providing a 3D printable filament, the 3D printable filament comprising a thermoplastically workable material and filler particles, wherein the filler particles comprise hexagonal boron nitride particles comprising hexagonal boron nitride platelets, melting the 3D printable filament, extruding the molten filament from a nozzle to form a continuous strand and depositing the continuous strand on a substrate in a predetermined pattern layer by layer to form a filamentary structure, and cooling the filamentary structure to form a 3D printed component part comprising the thermoplastically workable material and filler particles dispersed therein, wherein the filler particles comprise hexagonal boron nitride particles comprising hexagonal boron nitride platelets, the hexagonal boron nitride platelets having a predetermined orientation in the cooled thermoplastically workable material.
12. The method of claim 11, wherein the ratio of the width of the continuous strand to the height of the continuous strand is more than 2, and wherein the hexagonal boron nitride platelets have a basal plane, and wherein the basal plane of the hexagonal boron nitride platelets is oriented parallel to the substrate.
13. The method of claim 11, wherein the ratio of the width of the continuous strand to the height of the continuous strand is less than 1, and wherein the hexagonal boron nitride platelets have a basal plane, and wherein the basal plane of the hexagonal boron nitride platelets is oriented perpendicular to the substrate.
14. The method of any of claims 11 to 13, wherein at least one part of the continuous strand is deposited in portions being oriented parallel to one another.
15. Use of the component part of any of claims 9 to 12 as thermal conduction means to control the temperature of electrical and electronic components or assemblies or batteries.