发明人：
JANSSEN, ESTHER ANNA WILHELMINA GERARDA | DE SAMBER, MARC ANDRE | VAN GRUNSVEN, ERIC CORNELIS EGBERTUS | JACOBS, EGBERTUS REINIER
摘要：
The invention provides a liquid immersion transfer process for applying electronics (10) on a 3D object (20), the process comprising: (i) providing a foil (110) on a solid carrier (120) in a foil provision stage; (ii) providing electronic wiring (130) and an electronic component (140) to the foil (110) in an electronics provision stage, to provide said electronics (10); (iii) removing the solid carrier (120) and arranging the foil (110) on or in a liquid (30) in a liquid application stage; and (iv) transferring the electronics (10) to the 3D object (20) in a transfer stage, as well as a 3D object (20) obtainable by such process.
技术问题语段：
The technical problem described in this patent is the need for a flexible and efficient method to integrate electronics with 3D objects, without compromising their flexibility or electrical power. Existing technologies have limitations in terms of flexibility and complexity of the 3D objects that can be generated/processed. The patent aims to provide a solution to this problem by introducing a new method for integrating electrical components with 3D objects.
技术功效语段：
This patent describes a method for creating 3D shaped electronic devices using a combination of pre-fabricated planar assemblies and inorganic LEDs. The method allows for cost-effective fabrication of real 3D objects using standard planar assembly and circuitry techniques. The printed design can be transferred to the 3D object using a liquid soluble material and a foil. The printed design can be softened to make it easier to apply on the 3D object without folds. The method also allows for the application of electronic wiring, components, and printed design to the 3D object in different ways, such as by moving the object from above or below the liquid. A top coating can be applied to improve the integrity and stability of the material provided to the 3D object. The method can be used to create bio-compatible, bio-resistant, or bio-degradable devices.
权利要求：
1. A liquid immersion transfer process for applying electronics (10) on a 3D object (20), the process comprising: - providing a foil (110) on a solid carrier (120) in a foil provision stage; - providing electronic wiring (130) and an electronic component (140) to the foil (110) in an electronics provision stage, to provide said electronics (10); - removing the solid carrier (120) and arranging the foil (110) on or in a liquid (30) in a liquid application stage; - transferring the electronics (10) to the 3D object (20) in a transfer stage.
2. The liquid immersion transfer process according to claim 1, wherein the liquid (30) comprises an aqueous liquid, and wherein the foil (110) comprises a liquid soluble material.
3. The liquid immersion transfer process according to any one of the preceding claims, wherein one or more of the foil provision stage and the electronics provision stage also include providing a printed design (40) to the foil (110).
4. The liquid immersion transfer process according to claim 3, wherein the printed design (40) comprises an acrylic ink, and wherein the liquid soluble material comprises polyvinyl alcohol (PVA).
5. The liquid immersion transfer process according to any one of the preceding claims, wherein the electronics provision stage comprises printing or coating said electronic wiring (130) on said foil (110).
6. The liquid immersion transfer process according to claim 5, comprising applying one or more of a paste, an ink, and a foil strip, wherein the one or more of the paste, the ink and the foil strip comprise one or more of silver comprising curable material and copper comprising curable material.
7. The liquid immersion transfer process according to any one of the preceding claims, wherein the electronics provision stage comprises dispensing or printing locally an electrically conductive connector material (132) to said foil (110) and arranging said electronic component (140) to said foil (110), wherein the electrically conductive connector material (132) is configured to functionally connect the electric component (140) and the electronic wiring (130), and wherein the electrically conductive material comprises an electrically conductive adhesive.
8. The liquid immersion transfer process according to any one of the preceding claims, wherein one or more of the liquid application stage and the transfer stage further comprise one or more of (i) softening an ink comprising printed design (40) and (ii) pretreating at least part of the 3D object (20).
9. The liquid immersion transfer process according to any one of the preceding claims, wherein in the transfer stage the 3D object (20) is at least partially submerged in the liquid (30) before transfer, and wherein the transfer is effected by moving the 3D object (20) from below the electronics (10) to a position over the liquid (30).
10. The liquid immersion transfer process according to any one of the preceding claims, wherein subsequent to the transfer stage, the process further comprises one or more of (i) a curing stage, wherein the curing stage comprises curing the electronic wiring (130), and (ii) a coating stage, wherein the coating stage comprises applying a top coating (50) to at least part of the 3D object (20) comprising said electronics (10).
11. The liquid immersion transfer process according to any one of the preceding claims, wherein the electronic component (140) comprises one or more of a solid state light source (141), a sensor (142), an electronic solar cell (143), and an electronic touch button (144).
12. The liquid immersion transfer process according to any one of the preceding claims, the process further comprising deriving from a virtual 3D model of the final 3D object (20) a 2D design of the electronics (10) on the foil (110) and executing the liquid immersion transfer process in conformance with the 2D design.
13. A 3D object (20) comprising a non-flat 3D object part (21) and a layer structure (150) attached to said non-flat 3D object part (21), wherein the layer structure (150) comprises (i) a top coating (50), (ii) electronics (10) and (iii) a printed design (40), wherein the electronics (10) and the printed design (40) are configured between the non-flat 3D object part (21) and the top coating (50), wherein the electronics (10) comprises electronic wiring (130) and an electronic component (140).
14. The 3D object (20) according to claim 13, wherein the non-flat 3D object part (21) comprises one or more curvatures (221), wherein the electronic component (140) comprises one or more of a solid state light source (141), a sensor (142), and an electronic solar cell (143), wherein one or more of the non-flat 3D object part (21) and the top coating (50) are transmissive for light (3), and wherein the 3D object (20) further comprises two or more connectors (11) for electronically connecting the electronics (10) to a power source (2).
15. A system (1000) comprising: - an electronics applicator (1100) configured to apply electronics (10) to a foil (110) in an electronics provision stage, wherein the electronics (10) comprise electronic wiring (130) and an electronic component (140); - a liquid immersion transfer apparatus (1200) configured to transfer the electronics (10) to a 3D object (20) in a liquid (30) in a transfer stage; and - a post-immersion treatment apparatus (1300) configured to apply a top coating (50) to at least part of the 3D object (20).