当前申请(专利权)人地址：
2 RUE KELLERMANN,59100,ROUBAIX,FR
摘要：
A cooling device mountable on an electronic component comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough. The body comprises a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough; a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall or a perimeter of the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.
权利要求：
1. Claims 1. A cooling device mountable on an electronic component, the cooling device comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough, the body comprising: a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough, a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall and/or the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface from an immersion cooling liquid when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.
2. The cooling device of claim 1, wherein the at least one side wall and/or the first surface includes a channel formed therein, the channel being sized and shaped to house the gasket.
3. The cooling device of claim 2, wherein the channel has a width which is larger than a depth of the channel.
4. The cooling device of claim 2, wherein the channel is defined by a channel wall having at least one linear or curved channel wall portion.
5. The cooling device of claim 2, wherein the first surface has a first surface area which is smaller than a second surface area of the second surface.
6. The cooling device of claim 1, wherein the gasket is made of an elastomeric material.
7. The cooling device of claim 1, wherein the gasket is made of an epoxy resin.
8. The cooling device of claim 7, wherein the gasket is made by applying the epoxy resin to the first surface before polymerization.
9. The cooling device of claim 1, wherein the gasket is of one piece construction.
18.24386.1
10.534/773 Date Recue/Date Received 2022-03-18 10. The cooling device of claim 1, wherein one or both of the gasket and the body of the cooling device is made of a material resilient to the immersion cooling liquid.
11. The cooling device of claim 1, further comprising a thermal paste on the first surface, the gasket configured to fluidly insulate the thermal paste when the first surface is mounted on the electronic component.
12. The cooling device of claim 11, wherein the thermal paste does not contain indium.
13. The cooling device of claim 1, wherein the first surface is on an opposite side of the body to the second surface.
14. The cooling device of claim 1, wherein the body has a body perimeter shape selected from a rectangle, a square and a circle.
15. The cooling device of claim 1, wherein the heat-transfer fluid flowing in the internal fluid conduit is water.
16. The cooling device of claim 1, wherein a cold inlet and a hot outlet extend through the body at the first surface or the second surface.
17. A cooling system comprising: at least one cooling device comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough, the body comprising: a first surface configured for mounting on an electronic component and permitting thermal transfer therethrough, a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall and/or the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface from an immersion cooling liquid when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use; and 18724386.1 100534/773 Date Recue/Date Received 2022-03-18 an immersion case configured to immerse the electronic component and the cooling device housed therein in the immersion cooling liquid. 18. The cooling system of claim 17, further comprising: an external fluid cooling unit configured to receive a flow of the heat- transfer fluid from the cooling device, the external fluid cooling unit being adapted to dissipate heat from the heat-transfer fluid; and a pump adapted to maintain the flow of the heat-transfer fluid circulating in a cooling circuit, allowing to transfer thermal energy from the at least one cooling device to the heat-transfer fluid and to transfer thermal energy from the heat-transfer fluid to the external fluid cooling unit.
19. A method for cooling an electronic component, comprising: placing a cooling device of claim 1 on an electronic component such that the gasket fluidly seals the first surface of the cooling device; and immersing the cooling device and the electronic component in the immersion cooling liquid.
20. The method of claim 19, further comprising pumping the heat-transfer fluid through the internal fluid conduit defined by the cooling device, wherein the immersion cooling liquid is different than the heat-transfer fluid. 18724386.1 100534/773 Date Recue/Date Received 2022-03-18