摘要：
In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 µ?? or less, or about 35 µ?? or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
权利要求：
What is claimed is: 1. An illumination system, comprising: a substrate comprising a substrate bond pad; a light emitter attached to the substrate, the light emitter comprising a light emitter bond pad; an electrical interconnect over the light emitter, the electrical interconnect contacting the light emitter bond pad at one end of the electrical interconnect and contacting the substrate bond pad at an other end of the electrical interconnect, wherein a cross-sectional shape of the electrical interconnect, as viewed in a plane traverse to an elongate axis of the electrical interconnect, has a width larger than a height of the cross-sectional shape.
2. The illumination system of Claim 1, wherein a maximum height of the electrical interconnect above the light emitter is 50 µm or less.
3. The illumination system of Claim 1, wherein the electrical interconnect conformally follows contours of the light emitter.
4. The illumination system of Claim 3, wherein the light emitter defines a step over the substrate, wherein the electrical interconnect follows contours of the step.
5. The illumination system of Claim 1, wherein the cross-sectional shape is rectangular.
6. The illumination system of Claim 1, wherein the electrical interconnect comprises a metal.
7. The illumination system of Claim 1, wherein the light emitter is a LED chip,
8. The illumination system of Claim 1, wherein the substrate is a printed circuit board.
9. The illumination system of Claim 1, further comprising a dielectric layer between the light emitter and the electrical interconnect.
10. The illumination system of Claim 1, wherein the light emitter further comprises an other light emitter bond pad, and an other electrical interconnect contacting the other light emitter bond pad at one end of the other electrical interconnect and contacting an other substrate bond pad at an other end of the electrical interconnect, wherein a cross-sectional shape of the other electrical interconnect, as viewed in a plane traverse to an elongate axis of the electrical interconnect, has a width larger than a height.
11. The illumination system of Claim 1, further comprising a light pipe over an exposed surface of the light emitter.
12. The illumination system of Claim 11, further comprising: a light modulating device configured to receive light from the light pipe; and a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the light modulating device.
13. The illumination system of Claim 12, further comprising a plurality of the light pipes, each light pipe configured to transmit light to the light modulating device.
14. The illumination system of Claim 1, further comprising a reflector over an exposed surface of the light emitter.
15. The illumination system of Claim 14, further comprising: a light modulating device configured to receive light from the reflector; and a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the light modulating device
16. The illumination system of Claim 14, further comprising a plurality of the reflectors, each reflector configured to direct light to the light modulating device.
17. A method for making an illumination device, comprising: providing a light emitter over a substrate comprising a substrate bond pad, the light emitter comprising a light emitter bond pad; depositing an electrical interconnect over the light emitter and in contact with the light emitter bond pad and the substrate bond pad.
18. The method of Claim 17, wherein depositing the electrical interconnect comprises 3D printing the electrical interconnect.
19. The method of Claim 17, further comprising depositing a dielectric material over the light emitter before depositing the electrical interconnect.
20. The method of Claim 17, wherein depositing the dielectric material comprises 3D print the dielectric material.
21. The method of Claim 17, wherein depositing the electrical interconnect comprises depositing a metal.
22. The method of Claim 17, wherein the light emitter is a LED chip.
23. The method of Claim 17, wherein a maximum height of the electrical interconnect above the light emitter is 50 µm or less.
24. The method of Claim 17, further comprising coupling a light pipe to the light emitter, wherein a light input surface of the light pipe faces an exposed surface of the light emitter.
25. The method of Claim 17, further comprising coupling a reflector to the light emitter, wherein a light input surface of the reflector faces an exposed surface of the light emitter.
26. The method of Claim 17, wherein providing the light emitter comprised attaching the light emitter on an electrical contact on a surface of the substrate.