摘要：
Abstract of the Disclosure A method for making an illumination device, comprising: providing a light emitter over a substrate comprising a substrate bond pad, the light emitter comprising a light emitter bond pad; depositing an electrical interconnect over the light emitter and in contact with the light emitter bond pad and the substrate bond pad. Fig. 1 WO 2017/147322 PCT/US2017/019178 1/14 AM0 ,r520 510.-
技术问题语段：
The patent text discusses a low profile interconnect for light emitters, specifically light emitting diodes (LEDs), mounted on substrates. The technical issue addressed is the need for light sources that can meet the requirements of modern devices in terms of efficiency, robustness, and compactness.
权利要求：
1. A method for making a display device, comprising:
providing a light emitter over a substrate comprising a substrate bond pad, the light emitter comprising a light emitter bond pad;
providing an electrical interconnect over the light emitter, the electrical interconnect conformally following contours of the light emitter and in contact with the light emitter bond pad at one end of the electrical interconnect and the substrate bond pad at an other end of the electrical interconnect, and wherein a cross-sectional shape of the electrical interconnect, as viewed in a plane transverse to an elongate axis of the electrical interconnect, has a width larger than a height of the cross-sectional shape by a factor of 50 or more; and
coupling a light-guiding optical structure to the light emitter, wherein the light-guiding optical structure is disposed over an exposed surface of the electrical interconnect, wherein the light-guiding optical structure is separated by an air gap from the exposed surface of the electrical interconnect.
2. The method of Claim 1, wherein providing the electrical interconnect comprises 3D printing the electrical interconnect.
3. The method of Claim 1 or Claim 2, further comprising providing a dielectric material over the light emitter before depositing the electrical interconnect.
4. The method of any one of the Claims 1 to 3, wherein providing the dielectric material comprises 3D printing the dielectric material.
5. The method of any one of the Claims 1 to 4, wherein providing the electrical interconnect comprises depositing a metal.
6. The method of any one of the Claims 1 to 5, wherein the light emitter is a LED chip.
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7. The method of any one of the Claims 1 to 6, wherein a maximum height of the electrical interconnect above the light emitter is 50 pm or less.
8. The method of any one of the Claims 1 to 7, wherein the light guiding structure is a light pipe.
9. The method of any one of the Claims 1 to 8, wherein the light guiding optical
structure is a reflector.
10. The method of any one of the Claims 1 to 9, wherein providing the light emitter comprises attaching the light emitter on an electrical contact on a surface of the substrate.
11. The method of Claim 1, wherein the light emitter defines a step over the
substrate, wherein the electrical interconnect follows the contours of the step after the
providing of the electrical interconnect.
12. The method of Claim 1, wherein the cross-sectional shape is rectangular.
13. The method of any one of the Claims 1 to 12, wherein the substrate is a
printed circuit board.
14. The method of any one of the Claims 1 to 13, wherein the light emitter further comprises another light emitter bond pad.
15. The method of Claim 14, further comprising providing another electrical interconnect over the light emitter and in contact with the other light emitter bond pad and another substrate bond pad.
16. The method of Claim 8, further comprising:
providing a light modulating device configured to receive light from the light pipe; and
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providing a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the light modulating device.
17. The method of Claim 16, further comprising: providing a plurality of the light pipes, each light pipe configured to transmit light to the light modulating device.
18. The method of Claim 9, further comprising:
providing a light modulating device configured to receive light from the light pipe; and
providing a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the light modulating device.
19. The method of Claim 18, further comprising: providing a plurality of the reflectors, each reflector configured to direct light to the light modulating device.