摘要：
A composite coin, coin black, medal or token structure provides an inner stack, an outer ring surrounding the inner stack, and a separator, an authentication method and method of manufacture for the same. The inner stack comprises one or more inserts stacked on top of each other. The separator is disposed between the outer ring and the inner stack separating the outer ring from the inner stack and separating the plurality of inserts from each other.
权利要求：
WHAT IS CLAIMED IS:
1. A coin structure comprising:
an inner stack comprising a plurality of inserts stacked on top of each other and at least one of the plurality of inserts comprises a metallic material;
an outer ring annularly surrounding the inner stack, the outer ring comprising a metallic material: and
a separator disposed between the outer ring and the inner stack separating the outer ring from the inner stack and separating the plurality of inserts from each other for retaining the inner stack within the outer ring.
2. The coin structure of claim 1, wherein the separator comprises a separator wall disposed between the outer ring and the inner stack, and defining an interior area housing the inner stack, the separator wall having an outer face and an inner face.
3. The coin structure of claim 2, wherein the separator comprises at least one divider disposed within the interior area.
4, The coin structure of claim 3, wherein the at least one divider separates the plurality of inserts from each other.
5, The coin structure of claim 2, wherein the inner face of the separator wall comprises at least one recess.
6. The coin structure of any one of claims 1 to 5, wherein the separator comprises a polymeric, metallic, semi-metallic, glass, ceramic, or composite material.
7. The coin structure of any one of claims 1 to 6, wherein the separator comprises a dielectric material.
8. The coin structure of any one of claims 1 to 6, wherein the separator comprises a conductive material.
9. The coin structure of any one of claims 1 to 6, wherein the separator comprises a semi-conductive material.
10. The coin structure of any one of claims 1 to 9, wherein an outer circumferential surface of each of the plurality of inserts comprises at least one recess.
11. The coin structure of any one of claims 1 to 9, wherein an inner circumferential surface of the outer ring comprises at least one recess.
12. The coin structure of any one of claims 1 to 9, wherein the plurality of inserts and the separator are locked together by at least one recess formed in an outer circumferential surface of the plurality of inserts.
13. The coin structure of any one of claims 1 to 9, wherein the separator and the outer ring are locked together by at least one recess formed in an outer circumferential surface of separator.
14. The coin structure of any one of claims 1 to 9, wherein the separator and the outer ring are locked together by at least one recess formed in an inner circumferential surface of the outer ring.
15. The coin structure of claim 1, wherein the separator comprises at least one divider comprising at least one aperture and separating the plurality of inserts and defining a void between the plurality of inserts.
16. The coin structure of claim 15, wherein the at least one divider comprises at least one protrusion extending to at least one outer surface of the inner stack.
17. The coin structure of any one of claims 1 to 16, wherein the separator is marked with at least one figure or symbol.
18. The coin structure of any one of claims 1 to 17, wherein at least one insert is marked with at least one figure or symbol.
19. The coin structure of any one of claims 1 to 18, wherein the separator comprises particles in micro or nano scale.
20. The coin structure of any one of claims 1 to 19, wherein the separator is transparent.
21. The coin structure of any one of claims 1 to 19, wherein the separator is translucent or opaque.
22. The coin structure of any one of claims 1 to 19, wherein the separator is colorless.
23. The coin structure of any one of claims 1 to 19, wherein the separator is colored.
24. The coin structure of any one of claims 1 to 23, wherein the composite structure is a coin.
25. The coin structure of any one of claims 1 to 23, wherein the composite structure is a coin blank.
26. The coin structure of any one of claims 1 to 23, wherein the composite structure is a medal.
27. The coin structure of any one of claims 1 to 23, wherein the composite structure is a token.
28. The coin structure of any one of claims 1 to 23, wherein the composite structure is a chip.
29. The coin structure of any one of claims 1 to 23, wherein the composite structure is a gaming chip.
30. The coin structure of any one of claims 1 to 23, wherein the composite structure is a medallion.
31. The coin structure of any one of claims 1 to 23, wherein the separator varies in cross-sectional area.
32. The coin structure of any one of claims 15, 16, and 17 to 31 when dependent on claim 15 or 16, wherein the separator comprises a major axis and at least one minor axis and defines the aperture as a circle.
33. The coin structure of any one of claims 15, 16, and 17 to 31 when dependent on claim 15 or 16, wherein the separator comprises a major axis and at least one minor axis and defines the aperture as non-circular.
34. A method for authenticating a composite structure, the composite structure comprising an inner stack of inserts, an outer ring and a separator disposed between the outer ring and the inner stack separating the outer ring from the inner stack for retaining the inner stack within the outer ring, comprising:
setting at least one pre-determined reference standard frequency- dependent capacitance or conductivity value range for at least one of:
a first and a second stacked insert:
a first insert and an outer ring; and
a second insert and the outer ring;
measuring at least one measured frequency-dependent capacitance or conductivity value between at least one of:
a first and a second stacked insert:
a first insert and the outer ring; and
a second insert and the outer ring;
comparing the at least one measured frequency-dependent capacitance or conductivity value to the corresponding pre-determined reference standard range; and
authenticating the composite structure if the measured frequency- dependent capacitance or conductivity values falls within the pre-determined reference standard range.
35. A method for manufacturing a composite structure comprising:
stacking a plurality of inserts on top of each other to form an inner stack, wherein at least one of the plurality of inserts comprises a metallic material;
disposing a separator between the plurality of inserts for separating the plurality of inserts from each other and annularly surrounding the inner stack and separator with an outer ring, wherein the outer ring comprises a metallic material, to form a pre-assembly, the pre-assembly having opposite first and second sides;
arranging the pre-assembly on a die, the die having a first engraving for impressing upon the first side of the pre-assembly; and
applying pressure to the pre-assembly with a press, the press having a second die with a second engraving for simultaneously striking and stamping the pre-assembly and producing the composite structure.