摘要：
In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μιη or less, or about 35 μιη or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
权利要求：
‘What is claimed is:
1. A display system, comprising:
a substrate comprising a substrate bond pad;
a light emitter attached to the substrate, the light emitter comprising a light
emitter bond pad;
an electrical interconnect over the light emitter, the electrical interconnect
contacting the light emitter bond pad at one end of the electrical interconnect and
contacting the substrate bond pad at an other end of the electrical interconnect;
a light pipe over an exposed surface of the light emitter;
a spatial light modulator configured to receive light from the light pipe and to
modulate the light to define images; and
wherein a cross-section of the electrical interconnect in a plane traverse to a
length dimension of the electrical interconnect has a width larger than a thickness of
the electrical interconnect.
2 The display system of Claim 1, wherein a maximum thickness of the electrical interconnect above the light emitter is 50 um or less.
3. The display system of Claim 1 or Claim 2, wherein the electrical interconnect conformally follows contours of the light emitter,
4. The display system of Claim 3, wherein the light emitter defines a step over the substrate, wherein the electrical interconnect follows contours of the step.
8. The display system of any one of the Claims 1 to 4, wherein the cross-sectional shape is rectangular.
6. The display system of any one of the Claims 1 to 5, wherein the electrical interconnect comprises a metal.
7 The display system of any one of the Claims 1 to 6, wherein the light emitter is a LED chip.
8. The display system of any one of the Claims 1 tp 7, wherein the substrate is a printed circuit board.
9. The display system of any one of the Claims 1 to 8, further comprising a dielectric layer between the light emitter and the electrical interconnect.
10. The display system of any one of the Claims 1 to 9, wherein the light emitter further comprises an other light emitter bond pad, and an other electrical interconnect contacting the other light emitter bond pad at one end of the other electrical interconnect and contacting an other substrate bond pad at an other end of the electrical interconnect,
wherein a cross-section of the other electrical interconnect in a plane traverse
to a length dimension of the electrical interconnect has a width larger than a thickness
of the other electrical interconnect.
11. The display system of any one of the Claims 1 to 10, further comprising a plurality of the light pipes, each light pipe configured to transmit light to the spatial light modulator.
12. The display system of any one of the Claims 1 to 11, further comprising a reflector over an exposed surface of the light emitter, wherein the spatial light modulator is configured to receive light from the reflector.
13. The display system of Claim 12, further comprising a plurality of the reflectors, each reflector configured to direct light to the spatial light modulator.
14. The display system of any one of the Claims 1 to 12, further comprising a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the spatial light modulator and a light outcoupling optical element configured to eject incoupled light from the waveguide.